Semiconductor device

ABSTRACT

A semiconductor device includes a semiconductor layer of a first conductivity type. A well region that is a second conductivity type well region is formed on a surface layer portion of the semiconductor layer and has a channel region defined therein. A source region that is a first conductivity type source region is formed on a surface layer portion of the well region. A gate insulating film is formed on the semiconductor layer and has a multilayer structure. A gate electrode is opposed to the channel region of the well region where a channel is formed through the gate insulating film.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/680,864, filed Feb. 25, 2022 (Atty. Dkt. No. ROHM61-35490), which isa continuation of U.S. patent application Ser. No. 17/464,303, filedSep. 1, 2021, entitled SEMICONDUCTOR DEVICE, issued as U.S. Pat. No.11,296,223 on Apr. 5, 2022 (Atty. Dkt. No. ROHM61-35359), which is acontinuation of U.S. patent application Ser. No. 17/328,822, filed May24, 2021, entitled SEMICONDUCTOR DEVICE, issued as U.S. Pat. No.11,610,992 on Mar. 21, 2023 (Atty. Dkt. No. ROHM61-35267), which is acontinuation of U.S. patent application Ser. No. 17/016,989, filed Sep.10, 2020, entitled SEMICONDUCTOR DEVICE, issued as U.S. Pat. No.11,043,589 on Jun. 22, 2021 (Atty. Dkt. No. ROHM61-34995), which is acontinuation of U.S. patent application Ser. No. 16/714,038, filed Dec.13, 2019, entitled SEMICONDUCTOR DEVICE, issued as U.S. Pat. No.10,804,392 on Oct. 13, 2020 (Atty. Dkt. No. ROHM61-34794), which is acontinuation of U.S. patent application Ser. No. 16/418,360, filed May21, 2019, entitled SEMICONDUCTOR DEVICE, now U.S. Pat. No. 10,546,954,issued on Jan. 28, 2020 (Atty. Dkt. No. ROHM61-34577). U.S. patentapplication Ser. No. 16/418,360 was a continuation of U.S. patentapplication Ser. No. 15/868,389, filed Jan. 11, 2018, and issued as U.S.Pat. No. 10,319,853 on Jun. 11, 2019 (Atty. Dkt. No. ROHM61-34374),which was a continuation of U.S. application Ser. No. 15/273,230, filedSep. 22, 2016, and issued as U.S. Pat. No. 9,893,180 on Feb. 13, 2018,which was a continuation of U.S. application Ser. No. 14/995,454, filedJan. 14, 2016, and issued as U.S. Pat. No. 9,496,393 on Nov. 15, 2016,which was a continuation of U.S. application Ser. No. 14/601,345, filedJan. 21, 2015, and issued as U.S. Pat. No. 9,257,521 on Feb. 9, 2016,which was a continuation of U.S. application Ser. No. 14/148,766, filedJan. 7, 2014, and issued as U.S. Pat. No. 8,969,877 on Mar. 3, 2015,which was a continuation of U.S. application Ser. No. 13/394,549, filedMay 17, 2012, and issued as a U.S. Pat. No. 8,653,533 on Feb. 18, 2014,which was a 371 National Stage application of PCT/JP2010/065057, filedSep. 2, 2010, which claimed benefit from Japanese Patent ApplicationNos. 2009-206374, filed Sep. 7, 2009, 2009-206373, filed Sep. 7, 2009,and 2009-206372, filed Sep. 7, 2009, the specifications of each areincorporated by reference herein in their entireties.

TECHNICAL FIELD

The present invention relates to a semiconductor device and a method ofmanufacturing the same.

BACKGROUND ART

SiC (silicon carbide) is superior in dielectric breakdown resistance andthermal conductivity etc. to Si (silicon). Therefore, SiC is watchedwith interest as a semiconductor suitable to a use for an inverter of ahybrid car or the like, for example. More specifically, a MISFET (MetalInsulator Semiconductor Field Effect Transistor) employing SiC isexpected as a high withstand voltage device suitable to an inverter of ahybrid car or the like.

A MOSFET (Metal Oxide Semiconductor Field Effect Transistor) as anexample of a MISFET employing SiC has an SiC-MOS structure obtained bystacking a gate electrode on an SiC substrate through a gate insulatingfilm made of SiO₂ (silicon oxide). A well region is formed on a surfacelayer portion of the SiC substrate. A source region and a drain regionare formed on a surface layer portion of the well region at an intervalfrom each other. The gate insulating film is formed on a region betweenthe source region and the drain region.

PRIOR ART Patent Document

-   Patent Document 1: Japanese Unexamined Patent Publication No.    2009-16530

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

The SiC-MOS structure has such a problem that high-density interfacestates are formed on the interface (SiO₂/SiC interface) between the SiCsubstrate and the gate insulating film. The number of the interfacestates (interface defects) increases as the thickness of the gateinsulating film made of SiO₂ enlarges.

Therefore, the inventors of this application examine employment of agate insulating film having not a single-layer structure of SiO₂, but anAlON/SiO₂ multilayer structure obtained by stacking an AlON (aluminumoxynitride) film on a relatively thin SiO₂ film.

In a case of comparing a gate insulating film of a single layer of SiO₂having a thickness of 40 nm and a gate insulating film of a multilayerstructure of an AlON film having a thickness of 65 nm and an SiO₂ filmhaving a thickness of 6 nm with each other, for example, reduction ofinterface state density is expected in the AlON/SiO₂ multilayer gateinsulating film, since the thickness of the SiO₂ film is small.

FIG. 11 is a graph showing field strength-leakage currentcharacteristics (relations between the strength of electric fields(Oxide Field) formed in the gate insulating films and leakage currentdensity (Gate Current Density)) of the AlON/SiO₂ multilayer gateinsulating film and the SiO₂ single-layer gate insulating film at roomtemperature. FIG. 12 is a graph showing field strength-leakage currentcharacteristics of the AlON/SiO₂ multilayer gate insulating film and theSiO₂ single-layer gate insulating film at high temperature.

As shown in FIGS. 11 and 12 , it has been confirmed that leakage currentis more reduced in the AlON/SiO₂ multilayer gate insulating film than inthe SiO₂ single-layer gate insulating film, not only at room temperature(about 25° C.) but also at high temperature of 200° C. The effect of thereduction is particularly strong in the range where the strength of theelectric field formed in the AlON/SiO₂ multilayer gate insulating filmis greater than 6 MV/cm. FIG. 13 is a graph showing evaluation resultsof interface state density of an SiC-MIS structure employing theAlON/SiO₂ multilayer gate insulating film and an SiC-MOS structureemploying the SiO₂ single-layer gate insulating film. In this graph, theaxis of abscissas shows energy (Ec-E) from valence band edges of thegate insulating films, and the axis of ordinates shows the interfacestate density Dit.

As to the respective ones of the SiC-MIS structure employing theAlON/SiO₂ multilayer gate insulating film and the SiC-MOS structureemploying the SiO₂ single-layer gate insulating film, high-frequency CVcharacteristics (at a measuring frequency of 100 kHz, for example) andlow-frequency CV characteristics (quasi-static CV characteristics) weremeasured, and the differences between high-frequency measured values andlow-frequency measured values were calculated as the interface statedensity Dit by a High-Low method.

While reduction of the interface state density resulting from thereduction of the thickness of the SiO₂ film is expected in the SiC-MISstructure employing the AlON/SiO₂ multilayer gate insulating film ascompared with the SiC-MOS structure employing the SiO₂ single-layer gateinsulating film, it has been recognized from the results shown in FIG.13 that the interface state density increases in practice. In a MISFET,increase of interface state density causes reduction of channelmobility.

An object of the present invention is to provide a semiconductor devicein which the state of an interface between a silicon carbide substrateand a silicon oxide film is excellent and a method of manufacturing thesame.

Solutions to Problems

A method of manufacturing a semiconductor device according to one aspectof the present invention includes the steps of forming a silicon oxide(SiO₂) film on a silicon carbide (SiC) substrate, annealing the siliconcarbide substrate and the silicon oxide film in gas containing hydrogen,and forming an aluminum oxynitride (AlON) film on the silicon oxide filmafter the annealing of the silicon carbide substrate and the siliconoxide film.

In the state where the silicon oxide film is simply formed on thesilicon carbide substrate, dangling bonds of carbon (C) atoms andsilicon (Si) atoms are present on the interface between the siliconcarbide substrate and the silicon oxide film. After the formation of thesilicon oxide film, the silicon carbide substrate and the silicon oxidefilm are annealed in the gas containing hydrogen, whereby hydrogen (H)atoms are bonded to the dangling bonds of the carbon atoms and thesilicon atoms, and the interface between the silicon carbide substrateand the silicon oxide film is hydrogen-terminated. Consequently, thenumber of defects (interface state density) on the interface between thesilicon carbide substrate and the silicon oxide film decreases, and thestate of the interface is improved.

After the annealing of the silicon carbide substrate and the siliconoxide film, the aluminum oxynitride film is formed on the silicon oxidefilm. The aluminum oxynitride film is present on the silicon oxide film,whereby dehydrogenation from the silicon carbide substrate and thesilicon oxide film is prevented. Therefore, the state of the interfacebetween the silicon carbide substrate and the silicon oxide filmimproved by the hydrogen termination is maintained.

According to the manufacturing method according to one aspect of thepresent invention, therefore, the state of the interface between thesilicon carbide substrate and the silicon oxide film can be improved,and the improved state can be maintained.

Consequently, a semiconductor device in which the state of an interfacebetween a silicon carbide substrate and a silicon oxide film isexcellent can be obtained. In other words, a semiconductor deviceincluding a silicon carbide substrate, a silicon oxide film formed onthe silicon carbide substrate and an aluminum oxynitride film formed onthe silicon oxide film, in which the interface between the siliconcarbide substrate and the silicon oxide film is hydrogen-terminated, canbe manufactured by the manufacturing method according to the presentinvention.

In a case where the semiconductor device includes a MISFET having thesilicon oxide film and the aluminum oxynitride film as a gate insulatingfilm, improvement of channel mobility can be attained due to reductionof interface state density.

The aluminum oxynitride film is a high dielectric constant film (High-kfilm). In the gate insulating film consisting of the silicon oxide filmand the aluminum oxynitride film, therefore, leakage current can bereduced while ensuring equivalent or higher electric characteristics ascompared with a gate insulating film consisting of only a silicon oxidefilm, by enlarging the thickness of the aluminum oxynitride film.Consequently, reliability of the gate insulating film can be improved.

A gate electrode formed on the aluminum oxynitride film is preferablymade of a metallic material containing aluminum. Thus, improvement inoperating speed of the MISFET and reduction of power consumption can beattained as compared with such a structure that a gate electrode is madeof polycrystalline silicon.

After the formation of the aluminum oxynitride film, the aluminumoxynitride film is preferably subjected to annealing (PDA: PostDeposition Annealing). Due to the annealing, crystallinity of thealuminum oxynitride film can be raised, and quality of the aluminumoxynitride film can be improved.

The annealing of the silicon carbide substrate and the silicon oxidefilm is preferably FGA (Forming Gas Annealing), and suitably performedin forming gas prepared by mixing hydrogen (H₂) and nitrogen (N₂) witheach other under a temperature condition of 450 to 1000° C. The forminggas suitably contains hydrogen in a ratio smaller than the explosionlimit, and more specifically, the forming gas suitably contains 3% ofhydrogen and 97% of nitrogen. The annealing of the silicon carbidesubstrate and the silicon oxide film is suitably performed in theforming gas at a temperature of 1000° C. for 30 minutes and thereafterperformed at a temperature of 450° C. for 30 minutes. Thus, hydrogenatoms can be excellently introduced into the silicon oxide film, and thenumber of dangling bonds of carbon atoms and silicon atoms present onthe interface between the silicon carbide substrate and the siliconoxide film can be effectively reduced.

Before the annealing of the silicon carbide substrate and the siliconoxide film, nitrogen plasma is preferably applied to the silicon oxidefilm. Thus, Si—O—C bonds and C—C clusters can be cut and dangling bondsof carbon atoms and silicon atoms can be formed on the interface betweenthe silicon carbide substrate and the silicon oxide film. Then, theannealing of the silicon carbide substrate and the silicon oxide film isperformed after the application of the nitrogen plasma, whereby hydrogenatoms can be easily bonded to the dangling bonds of the carbon atoms andthe silicon atoms present on interface between the silicon carbidesubstrate and the silicon oxide film. Consequently, the interfacebetween the silicon carbide substrate and the silicon oxide film can beexcellently hydrogen-terminated.

The silicon oxide film is preferably formed by thermal oxidationemploying gas containing a nitrogen oxide (NO_(x)). Thus, nitrogen atomscan be introduced into the silicon oxide film, and the dielectricconstant of the silicon oxide film can be raised. Consequently, leakagecurrent can be further reduced. Besides, further reduction of interfacestate density can be attained due to nitrogen termination on theinterface between the silicon carbide substrate and the silicon oxidefilm, and further improvement (betterment) of the channel mobility canbe expected.

A semiconductor device according to another aspect of the presentinvention includes a silicon carbide layer, a silicon oxynitride filmformed on the silicon carbide layer, a silicon oxide film formed on thesilicon oxynitride film, a high dielectric constant insulating film(High-k insulating film) formed on the silicon oxide film, and a gateelectrode formed on the high dielectric constant insulating film.

In other words, the semiconductor device according to the other aspectof the present invention includes a silicon carbide layer, a gateinsulating film formed on the silicon carbide layer, and a gateelectrode formed on the gate insulating film. The gate insulating filmhas a structure obtained by stacking a silicon oxynitride film, asilicon oxide film and a high dielectric constant insulating film fromthe side of the silicon carbide layer.

The silicon oxynitride film is interposed between the silicon carbidelayer and the silicon oxide film, whereby reduction of interface statedensity on the interface between the silicon carbide layer and the gateinsulating film can be attained as compared with such a structure that agate insulating film consists of only a silicon oxide film. Further,improvement of channel mobility can be attained due to the reduction ofthe interface state density.

In addition, reduction of leakage current resulting from increase inthickness of the gate insulating film can be attained while suppressingincrease of interface state density on the interface between the siliconcarbide layer and the gate insulating film by reducing the totalthickness of the silicon oxynitride film and the silicon oxide film andenlarging the thickness of the high dielectric constant insulating film.

Therefore, both of the improvement of the channel mobility resultingfrom the reduction of the interface state density and improvement ofreliability of the gate insulating film resulting from the reduction ofthe leakage current can be attained.

In a case where the total thickness of the silicon oxynitride film andthe silicon oxide film is not less than 1 nm and not more than 10 nm,the interface between the silicon carbide layer and the gate insulatingfilm can be brought into a particularly excellent state.

The high dielectric constant insulating film may be an aluminumoxynitride film.

The gate electrode is preferably made of a metallic material containingaluminum. Thus, improvement in operating speed of a MISFET and reductionof power consumption can be attained as compared with such a structurethat a gate electrode is made of polycrystalline silicon.

A semiconductor device according to still another aspect of the presentinvention includes a semiconductor layer made of first conductivity typeSiC, a second conductivity type well region formed on a surface layerportion of the semiconductor layer, a first conductivity type sourceregion formed on a surface layer portion of the well region, a gateinsulating film formed on the semiconductor layer, and a gate electrodeformed on the gate insulating film and opposed to a channel region ofthe well region where a channel is formed through the gate insulatingfilm. In the source region, the impurity concentration in a first regionof a prescribed width adjacent to the channel region is lower than theimpurity concentration in a second region other than the first region.

Thus, the rate (rate of oxidation) of growth of an oxide film on thesurface of the first region can be suppressed low by lowering theimpurity concentration in the first region of the source region adjacentto the channel region. Therefore, formation of a large step between thesurface of the first region and the surface of the channel region (wellregion) can be prevented after removal of the oxide film. Consequently,a path (movement path) of carriers moving from the source region to thechannel region can be approximated to a straight line, whereby reductionof channel resistance can be attained.

The impurity concentration in the second region of the source regionother than the first region is higher than the impurity concentration inthe first region, whereby a step where the surface of the second regionis lower by one stage than the surface of the first region is formedbetween the surface of the first region and the surface of the secondregion. Even if the step is formed between the surface of the firstregion and the surface of the second region, the step does not influencethe flow of the carriers in the channel region. Therefore, the channelresistance can be reduced without reducing the carrier concentration inthe source region by relatively lowering the impurity concentration inthe first region and relatively raising the impurity concentration inthe second region.

In a case where the source region and the channel region are adjacentlyformed in a direction along the upper surface of the semiconductorlayer, the respective upper surfaces of the source region and thechannel region become the surfaces thereof, and the gate insulating filmis formed on the upper surface of the semiconductor layer. Then, thegate electrode is provided on the gate insulating film, to be opposed tothe upper surface of the channel region. In other words, thesemiconductor device has a planar gate MIS (Metal InsulatorSemiconductor) structure.

In a case where the source region and the channel region are adjacentlyformed in a direction orthogonal to the upper surface of thesemiconductor layer, a trench dug down from the upper surface of thesource region is formed in the semiconductor layer, and the gateinsulating film is formed on the inner surface of the trench. The trenchpasses through the source region and the well region. Then, the gateelectrode is provided inside the gate insulating film, and embedded inthe trench. In other words, the semiconductor device has a trench gateMIS structure.

The foregoing and other objects, features and effects of the presentinvention will become more apparent from the following detaileddescription of the embodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic sectional view of a semiconductor device accordingto a first embodiment of the present invention.

FIG. 2 is a sectional view illustratively showing the structure of aninterface between an SiC substrate and an SiO₂ film.

FIG. 3 is a manufacturing step diagram for the semiconductor deviceshown in FIG. 1 .

FIG. 4 is a graph showing the relations between gate voltage (GateVoltage) and drain current (Drain Current).

FIG. 5 is a graph showing the relations between the strength of electricfields (Gate Oxide Field) formed in gate insulating films in samples 1and 2 and field effect mobility (Field Effect Mobility).

FIG. 6 is a graph showing temperature dependency of the field effectmobility of the sample 1.

FIG. 7 is a graph showing temperature dependency of the field effectmobility of the sample 2.

FIG. 8 is a graph showing the relation between each temperature and amaximum value of the field effect mobility at each temperature at thetime of examining the temperature dependency shown in FIGS. 6 and 7 .

FIG. 9 is a graph showing the relations between gate voltage (GateVoltage) and drain current (Drain Current) in samples 1 and 3.

FIG. 10 is a graph showing the relations between the strength ofelectric fields (Gate Oxide Field) formed in gate insulating films andfield effect mobility (Field Effect Mobility).

FIG. 11 is a graph showing field strength-leakage currentcharacteristics (relations between the strength of electric fields(Oxide Field) formed in gate insulating films and leakage currentdensity (Gate Current Density)) of an AlON/SiO₂ multilayer gateinsulating film and an SiO₂ single-layer gate insulating film at roomtemperature.

FIG. 12 is a graph showing field strength-leakage currentcharacteristics (relations between the strength of electric fields(Oxide Field) formed in the gate insulating films and leakage currentdensity (Gate Current Density)) of the AlON/SiO₂ multilayer gateinsulating film and the SiO₂ single-layer gate insulating film at hightemperature.

FIG. 13 is a graph showing evaluation results of interface state densityof an SiC-MIS structure employing the AlON/SiO₂ multilayer gateinsulating film and an SiC-MOS structure employing the SiO₂ single-layergate insulating film.

FIG. 14 is a schematic plan view of a semiconductor device according toa second embodiment of the present invention.

FIG. 15 is a schematic sectional view of the semiconductor device takenalong a cutting plane line A-A shown in FIG. 14 .

FIG. 16 is a schematic enlarged sectional view in the vicinity of asource region and a channel region shown in FIG. 15 .

FIG. 17 is a sectional view illustratively showing the structure of aninterface between an SiC substrate and an SiO₂ film.

FIG. 18A is a schematic sectional view showing a manufacturing step forthe semiconductor device.

FIG. 18B is a schematic sectional view showing a step subsequent to FIG.18A.

FIG. 18C is a schematic sectional view showing a step subsequent to FIG.18B.

FIG. 18D is a schematic sectional view showing a step subsequent to FIG.18C.

FIG. 18E is a schematic sectional view showing a step subsequent to FIG.18D.

FIG. 18F is a schematic sectional view showing a step subsequent to FIG.18E.

FIG. 18G is a schematic sectional view showing a step subsequent to FIG.18F.

FIG. 18H is a schematic sectional view showing a step subsequent to FIG.18G.

FIG. 18I is a schematic sectional view showing a step subsequent to FIG.18H.

FIG. 18J is a schematic sectional view showing a step subsequent to FIG.18I.

FIG. 18K is a schematic sectional view showing a step subsequent to FIG.18J.

FIG. 19 is a manufacturing step diagram for a gate insulating film.

FIG. 20 is a schematic diagram of a semiconductor device according to amodification.

FIG. 21 is a schematic diagram of a semiconductor device according toanother modification.

FIG. 22 is a schematic enlarged sectional view in the vicinity of asource region and a channel region shown in FIG. 21 .

FIG. 23 is a graph showing the relations between gate voltage (GateVoltage) and drain current (Drain Current).

FIG. 24 is a graph showing the relations between the strength ofelectric fields (Gate Oxide Field) formed in gate insulating films insamples 101 and 102 and field effect mobility (Field Effect Mobility).

FIG. 25 is a graph showing temperature dependency of the field effectmobility of the sample 101.

FIG. 26 is a graph showing temperature dependency of the field effectmobility of the sample 102.

FIG. 27 is a graph showing the relation between each temperature and amaximum value of the field effect mobility at each temperature at thetime of examining the temperature dependency shown in FIGS. 25 and 26 .

FIG. 28 is a graph showing the relations between gate voltage (GateVoltage) and drain current (Drain Current) in samples 101 and 103.

FIG. 29 is a graph showing the relations between the strength ofelectric fields (Gate Oxide Field) formed in gate insulating films andfield effect mobility (Field Effect Mobility).

FIG. 30 is a schematic sectional view of a semiconductor deviceaccording to reference example employing SiC.

FIG. 31 is a schematic enlarged sectional view in the vicinity of asource region and a channel region shown in FIG. 30 .

FIG. 32 is a schematic sectional view of a semiconductor deviceaccording to a third embodiment of the present invention.

FIG. 33 is a manufacturing step diagram for a gate insulating film.

FIG. 34 is a graph showing interface state density of an SiC-MISstructure employing an AlON/SiO₂/SiO_(x)N_(y) multilayer gate insulatingfilm and an SiC-MOS structure employing an AlON/SiO₂ multi-layer gateinsulating film.

FIG. 35 is another manufacturing step diagram for the gate insulatingfilm.

FIG. 36 is a schematic sectional view of a semiconductor deviceaccording to a modification.

FIG. 37 is a schematic sectional view of a semiconductor deviceaccording to another modification.

FIG. 38 is a schematic plan view of a semiconductor device according toa fourth embodiment of the present invention.

FIG. 39 is a schematic sectional view of the semiconductor device takenalong a cutting plane line B-B shown in FIG. 38 .

FIG. 40 is a schematic enlarged sectional view in the vicinity of asource region and a channel region shown in FIG. 39 .

FIG. 41A is a schematic sectional view showing a manufacturing step forthe semiconductor device.

FIG. 41B is a schematic sectional view showing a step subsequent to FIG.41A.

FIG. 41C is a schematic sectional view showing a step subsequent to FIG.41B.

FIG. 41D is a schematic sectional view showing a step subsequent to FIG.41C.

FIG. 41E is a schematic sectional view showing a step subsequent to FIG.41D.

FIG. 41F is a schematic sectional view showing a step subsequent to FIG.41E.

FIG. 41G is a schematic sectional view showing a step subsequent to FIG.41F.

FIG. 41H is a schematic sectional view showing a step subsequent to FIG.41G.

FIG. 41I is a schematic sectional view showing a step subsequent to FIG.41H.

FIG. 41J is a schematic sectional view showing a step subsequent to FIG.41I.

FIG. 41K is a schematic sectional view showing a step subsequent to FIG.41J.

FIG. 42 is a manufacturing step diagram for a gate insulating film.

FIG. 43 is a graph showing interface state density of an SiC-MISstructure employing an AlON/SiO₂/SiO_(x)N_(y) multilayer gate insulatingfilm and an SiC-MOS structure employing an AlON/SiO₂ multi-layer gateinsulating film.

FIG. 44 is another manufacturing step diagram for the gate insulatingfilm.

FIG. 45 is a schematic sectional view of a semiconductor deviceaccording to a modification.

FIG. 46 is a schematic sectional view of a semiconductor deviceaccording to another modification.

FIG. 47 is a schematic enlarged sectional view in the vicinity of asource region and a channel region shown in FIG. 46 .

FIG. 48 is a schematic sectional view of a semiconductor deviceaccording to still another modification.

FIG. 49 is a schematic plan view of a semiconductor device according toa fifth embodiment of the present invention.

FIG. 50 is a schematic sectional view of the semiconductor device takenalong a cutting plane line C-C shown in FIG. 49 .

FIG. 51 is a schematic enlarged sectional view in the vicinity of asource region and a channel region shown in FIG. 50 .

FIG. 52A is a schematic sectional view showing a manufacturing step forthe semiconductor device.

FIG. 52B is a schematic sectional view showing a step subsequent to FIG.52A.

FIG. 52C is a schematic sectional view showing a step subsequent to FIG.52B.

FIG. 52D is a schematic sectional view showing a step subsequent to FIG.52C.

FIG. 52E is a schematic sectional view showing a step subsequent to FIG.52D.

FIG. 52F is a schematic sectional view showing a step subsequent to FIG.52E.

FIG. 52G is a schematic sectional view showing a step subsequent to FIG.52F.

FIG. 52H is a schematic sectional view showing a step subsequent to FIG.52G.

FIG. 52I is a schematic sectional view showing a step subsequent to FIG.52H.

FIG. 52J is a schematic sectional view showing a step subsequent to FIG.52I.

FIG. 52K is a schematic sectional view showing a step subsequent to FIG.52J.

FIG. 53 is a schematic sectional view of a semiconductor deviceaccording to a modification.

FIG. 54 is a schematic sectional view of a semiconductor deviceaccording to another modification.

FIG. 55 is a schematic enlarged sectional view in the vicinity of asource region and a channel region shown in FIG. 54 .

MODES FOR CARRYING OUT THE INVENTION First Embodiment

FIG. 1 is a schematic sectional view of a semiconductor device accordingto a first embodiment of the present invention.

A semiconductor device 1 includes an SiC substrate 2 made of SiC(silicon carbide) doped with an N-type impurity.

A P-type well region 3 is formed on a surface layer portion of the SiCsubstrate 2.

An N⁺-type source region 4 doped with an N-type impurity in a higherconcentration than in the SiC substrate 2 and a drain region 5 areformed on a surface layer portion of the well region 3. The sourceregion 4 and the drain region 5 are formed at intervals from aperipheral edge portion of the well region 3 respectively, and at aninterval from each other.

A P⁺-type contact region 6 doped with a P-type impurity in a higherconcentration than in the well region 3 is formed on the surface layerportion of the well region 3. The contact region 6 is formed adjacentlyto a side of the source region 4 opposite to the drain region 5.

A gate insulating film 7 is formed on a region (channel region) betweenthe source region 4 and the drain region 5. More specifically, the gateinsulating film 7 is opposed to the region between the source region 4and the drain region 5, and extends over a peripheral edge portion ofthe source region 4 and a peripheral edge portion of the drain region 5.The gate insulating film 7 has an AlON/SiO₂ multilayer structureincluding a relatively thin SiO₂ film 8 made of SiO₂ (silicon oxide)containing N (nitrogen) and an AlON film 9 made of AlON (aluminumoxynitride) and formed on the SiO₂ film 8. The thickness of the SiO₂film 8 is 1 to 20 nm. The thickness of the AlON film 9 is 30 to 100 μm.

A gate electrode 10 having the same shape as the gate insulating film 7in plan view is formed on the gate insulating film 7. The gate electrode10 is made of a metallic material containing Al (aluminum).

A source electrode 11 is formed on the source region 4 and the contactregion 6. The source electrode 11 is in contact with the surfaces of thesource region 4 and the contact region 6 while extending over the same.The source electrode 11 is made of a metallic material containing Al.

A drain electrode 12 is formed on the drain region 5. The drainelectrode 12 is in contact with the surface of the drain region 5. Thedrain electrode 12 is made of a metallic material containing Al.

Thus, the semiconductor device 1 includes an N-channel MISFET(Negative-channel Metal Insulator Semiconductor Field EffectTransistor). Voltage of not less than a threshold is applied to the gateelectrode 10 in a state where the source electrode 11 is grounded andpositive voltage is applied to the drain electrode 12, whereby a channelis formed in the channel region of the well region 3 in the vicinity ofthe interface between the same and the gate insulating film, and currentflows from the drain electrode 12 toward the source electrode 11.

In the semiconductor device 1, a capacitance film 13 is selectivelyformed on a region of the SiC substrate 2 other than the well region 3.The capacitance film 13 has an AlON/SiO₂ multilayer structure includingan SiO₂ film 14 made of SiO₂ containing N and an AlON film 15 made ofAlON and formed on the SiO₂ film 14. The thicknesses of the SiO₂ film 14and the AlON film 15 are identical to the thicknesses of the SiO₂ film 8and the AlON film 9 respectively.

A capacitor electrode 16 having the same shape as the capacitance film13 in plan view is formed on the capacitance film 13. The capacitorelectrode 16 is made of the same material as the gate electrode 10, andhas the same thickness as the gate electrode 10.

Thus, the semiconductor device 1 includes a MIS capacitor.

FIG. 2 is a sectional view illustratively showing the structure of theinterface between the SiC substrate and the SiO₂ film.

Dangling bonds of C (carbon) atoms and Si (silicon) atoms present on theinterface between the SiC substrate 2 and the SiO₂ film 8 or 14 aresmall in number or generally nonexistent, and H (hydrogen) atoms arebonded to the C atoms and the Si atoms present on the interface betweenthe SiC substrate 2 and the SiO₂ film 8 or 14. In other words, theinterface between the SiC substrate 2 and the SiO₂ film 8 or 14 ishydrogen-terminated.

FIG. 3 is a manufacturing step diagram for the semiconductor device.

In order to manufacture the semiconductor device 1, an SiO₂ filmformation step (S1), a nitrogen plasma application step (S2), an FGA(Forming Gas Annealing) step (S3), an AlON film formation step (S4) anda PDA (Post Deposition Annealing) step (S5) are carried out in thisorder.

In the SiO₂ film formation step (S1), an SiO₂ film made of SiO₂containing N is formed on the SiC substrate 2 by thermal oxidationemploying gas containing N₂O (nitrogen oxide).

In the nitrogen plasma application step (S2), nitrogen plasma is appliedto the SiO₂ film. The nitrogen plasma is continuously applied over 30minutes in a state where the SiC substrate 2 is heated to 500° C., forexample. Atmospheric pressure and RF output at this time are 7.5 Torrand 50 W respectively, for example. The nitrogen plasma is applied tothe SiO₂ film, whereby Si—O—C bonds and C—C clusters are cut anddangling bonds of C atoms and Si atoms are formed on the interfacebetween the SiC substrate 2 and the SiO₂ film.

In the FGA step (S3), the SiC substrate 2 and the SiO₂ film are annealedin forming gas containing 3% of H₂ (hydrogen gas) and 97% of N₂(nitrogen gas). For example, annealing at a temperature of 1000° C. isperformed for 30 minutes, and annealing at a temperature of 450° C. isthereafter performed for 30 minutes. Thus, H atoms are excellentlyintroduced into the SiO₂ film, and the number of the dangling bonds ofthe C atoms and the Si atoms present on the interface between the SiCsubstrate 2 and the SiO₂ film decreases.

In the AlON film formation step (S4), an AlON film is formed on the SiO₂film by reactive sputtering employing mixed gas of N₂ and O₂ (oxygengas) and an Al target. In the PDA step (S5), the AlON film is annealedin N₂. The annealing is performed at a temperature of 900° C. for 30minutes, for example. Thus, crystallinity of the AlON film rises, andquality of the AlON film improves.

Thereafter the gate electrode 10 and the capacitor electrode 16 areformed on the AlON film. The gate electrode 10 and the capacitorelectrode 16 are formed by selectively vapor-depositing the material(Al) for the gate electrode on the surface of the AlON film with a mask,for example. Then, exposed portions (portions not opposed to the gateelectrode 10 and the capacitor electrode 16) of the AlON film and theSiO₂ film are removed by photolithography and etching, and the AlON filmand the SiO₂ film are worked into the AlON films 9 and 15 and the SiO₂films 8 and 14 respectively. When the source electrode 11 and the drainelectrode 12 are thereafter formed, the semiconductor device 1 shown inFIG. 1 is obtained.

In the state where the SiO₂ film is simply formed on the SiC substrate2, dangling bonds of C atoms and Si atoms are present on the interfacebetween the SiC substrate 2 and the SiO₂ film. After the formation ofthe SiO₂ film, therefore, the SiC substrate 2 and the SiO₂ film areannealed in the forming gas containing H₂. Thus, H atoms are bonded tothe dangling bonds of the C atoms and the Si atoms, and the interfacebetween the SiC substrate 2 and the SiO₂ film is hydrogen-terminated.Consequently, the number of defects (interface state density) on theinterface between the SiC substrate 2 and the SiO₂ film decreases, andthe state of the interface is improved.

After the annealing of the SiC substrate 2 and the SiO₂ film, the AlONfilm is formed on the SiO₂ film. The AlON film is present on the SiO₂film, whereby dehydrogenation from the SiC substrate 2 and the SiO₂ filmis prevented. Therefore, the state of the interface between the SiCsubstrate 2 and the SiO₂ film improved by the hydrogen termination ismaintained. Thus, the state of the interface between the SiC substrate 2and the SiO₂ film can be improved, and the improved state can bemaintained.

In the semiconductor device 1 manufactured by the manufacturing methodshown in FIG. 3 , therefore, the interfaces between the SiC substrate 2and the SiO₂ films 8 and 14 are hydrogen-terminated. Therefore, thesemiconductor device 1 has lower interface state density and can exhibithigher channel mobility as compared with a structure having largenumbers of dangling bonds on interfaces between an SiC substrate andSiO₂ films.

In the gate insulating film 7 consisting of the SiO₂ film 8 and the AlONfilm 9, leakage current can be reduced while ensuring equivalent orhigher electric characteristics as compared with a gate insulating filmconsisting of only an SiO₂ film, by enlarging the thickness of the AlONfilm 9. In the semiconductor device 1, therefore, reliability of thegate insulating film 7 is high as compared with the structure employingthe gate insulating film consisting of only an SiO₂ film.

The gate electrode 10 formed on the AlON film 9 is made of the metallicmaterial containing Al. Thus, improvement in operating speed of theMISFET and reduction of power consumption can be attained as comparedwith such a structure that the gate electrode 10 is made ofpolycrystalline silicon.

In the manufacturing steps for the semiconductor device 1, the AlON filmis annealed after the formation of the AlON film. Thus, thecrystallinity of the AlON film can be raised, and the quality of theAlON film can be improved.

Further, the nitrogen plasma is applied to the SiO₂ film before theannealing of the SiC substrate 2 and the SiO₂ film. Thus, Si—O—C bondsand C—C clusters can be cut and dangling bonds of carbon atoms andsilicon atoms can be formed on the interface between the SiC substrate 2and the SiO₂ film. Then, the annealing of the SiC substrate 2 and theSiO₂ film is performed after the application of the nitrogen plasma,whereby H atoms can be easily bonded to the dangling bonds of the Catoms and the Si atoms present on the interface between the SiCsubstrate 2 and the SiO₂ film. Consequently, the interface between theSiC substrate 2 and the SiO₂ film can be excellentlyhydrogen-terminated.

The SiO₂ film is formed by the thermal oxidation employing the gascontaining the nitrogen oxide (N₂O). Thus, N atoms can be introducedinto the SiO₂ film, and the dielectric constant of the SiO₂ film can beraised. Consequently, the leakage current can be further reduced.

(Characteristic Evaluation)

A sample 1 (AlON/SiO₂) having a MISFET of the structure shown in FIG. 1was prepared by the manufacturing method shown in FIG. 3 . In the sample1, the thickness of an SiO₂ film 8 is 10 nm, and the thickness of anAlON film 9 is 65 nm.

Further, a sample 2 (SiO₂) having a MOSFET of a structure obtained bystacking a gate electrode on an SiC substrate through a gate insulatingfilm consisting of a single layer of SiO₂ was prepared. In the sample 2,the thickness of the gate insulating film is 40 nm.

1. Drain Current

FIG. 4 is a graph showing the relations between gate voltage (GateVoltage) and drain current (Drain Current) in the samples 1 and 2.

As to the respective ones of the samples 1 and 2, magnitudes of thedrain current at times of varying the gate voltage were examined.

FIG. 4 shows the relation between the gate voltage and the drain currentin the sample 1 with a curve C1, and shows the relation between the gatevoltage and the drain current in the sample 2 with a curve C2.

2. Field Effect Mobility FIG. 5 is a graph showing the relations betweenthe strength of electric fields (Gate Oxide Field) formed in gateinsulating films and field effect mobility (Field Effect Mobility).

As to the respective ones of the samples 1 and 2, the magnitudes of thefield effect mobility at times of varying the electric fields formed inthe gate insulating films were examined.

FIG. 5 shows the relation between the strength of the electric fieldformed in a gate insulating film 7 and the field effect mobility in thesample 1 with a curve C3, and shows the relation between the strength ofthe electric field formed in the gate insulating film and the fieldeffect mobility in the sample 2 with a curve C4.

From the curves C1 to C4 shown in FIGS. 4 and 5 , it is understood thattransistor operating characteristics of the samples 1 and 2 aregenerally identical to each other. Also in the MISFET employing the gateinsulating film 7 consisting of the SiO₂ film 8 and the AlON film 9, thefield effect mobility is generally identical to that of the MOSFETemploying the gate insulating film consisting of the single layer ofSiO₂, and hence no increase is conceivably caused in interface statedensity by stacking the AlON film 9 on the SiO₂ film 8.

In the evaluation (see FIG. 13 ) of the interface state densitypreviously executed by the inventors of this application, therefore, theinterface state density of the SiC-MIS structure employing the AlON/SiO₂multilayer gate insulating film more increased than the interface statedensity of the SiC-MOS structure employing the SiO₂ single-layer gateinsulating film, is conceivable as a result of reflecting defects(defects on the AlON/SiO₂ interface, for example) not influencing thetransistor operating characteristics. More specifically, this evaluationis evaluation performed by calculating each interface state density ofthe SiC-MIS structure employing the AlON/SiO₂ multilayer gate insulatingfilm and the SiC-MOS structure employing the SiO₂ single-layer gateinsulating film by a High-Low method and comparing the same.

3. Temperature Characteristics

FIG. 6 is a graph showing temperature dependency of the field effectmobility of the sample 1. FIG. 7 is a graph showing temperaturedependency of the field effect mobility of the sample 2. FIG. 8 is agraph showing the relation between each temperature and a maximum valueof the field effect mobility at each temperature at the time ofexamining the temperature dependency shown in FIGS. 6 and 7 . In thegraphs shown in FIGS. 6 and 7 , the axes of abscissas show the strengthof the electric fields formed in the gate insulating films, and the axesof ordinates show the field effect mobility.

As to the respective ones of the samples 1 and 2, temperatures of SiCsubstrates were set to 110 K, 150 K, 200 K, 250 K, 300 K, 400 K, 500 Kand 600 K, and the relations between the strength of the electric fieldsformed in the gate insulating films and the field effect mobility ateach temperature were examined. FIG. 6 shows the relations at the timeswhen the temperatures of the SiC substrate were 110 K, 150 K, 200 k, 250K, 300 K, 400 K, 500 K and 600 K with curves C5, C6, C7, C8, C9, C10,C11 and C12 respectively. FIG. 7 shows the relations at the times whenthe temperatures of the SiC substrate were 110 K, 150 K, 200 k, 250 K,300 K, 400 K, 500 K and 600 K with curves C13, C14, C15, C16, C17, C18,C19 and C20 respectively. FIG. 8 shows the relation between the strengthof the electric field formed in the gate insulating film 7 and the fieldeffect mobility at each temperature in the sample 1 with a curve C21,and shows the relation between the strength of the electric field formedin the gate insulating film and the field effect mobility at eachtemperature in the sample 2 with a curve C22.

Comparing the curves C21 and C22 shown in FIG. 8 with each other, it isunderstood that the temperature dependency of the field effect mobilityof the sample 1 is smaller than the temperature dependency of the fieldeffect mobility of the sample 2, although the maximum value of the fieldeffect mobility of the sample 1 at each temperature is slightly lowerthan the maximum value of the field effect mobility of the sample 2 ateach temperature.

Comparing the curve C12 shown in FIG. 6 and the curve C20 shown in FIG.7 with each other, it is understood that the field effect mobility ofthe sample 1 is greater than the field effect mobility of the sample 2under the condition that high electric fields (electric fields of notless than 2 MV/cm) are formed in the gate insulating films at hightemperature. Therefore, the sample 1, i.e., the semiconductor device 1having the MISFET of the structure shown in FIG. 1 is suitable as apower device operating under the condition that an electric field of 3to 4 MV/cm is formed in the gate insulating film 7.

Further, a sample 3 having a MISFET of the structure shown in FIG. 1 wasprepared by a method omitting the nitrogen plasma application step (S2)and the FGA step (S3) from the manufacturing steps shown in FIG. 3 . Inthe sample 3, the thickness of an SiO₂ film 8 is 10 nm, and thethickness of an AlON film 9 is 65 nm.

4. Drain Current

FIG. 9 is a graph showing the relations between gate voltage (GateVoltage) and drain current (Drain Current) in the samples 1 and 3.

As to the respective ones of the samples 1 and 3, the magnitudes of thedrain current at times of varying the gate voltage were examined.

FIG. 9 shows the relation between the gate voltage and the drain currentin the sample 1 with a curve C23, and shows the relation between thegate voltage and the drain current in the sample 3 with a curve C24.

Comparing the curves C23 and C24 shown in FIG. 9 with each other, it isunderstood that the drain current obtained in the sample 1 is greaterthan the drain current obtained in the sample 3. Therefore, the nitrogenplasma application step (S2) and the FGA step (S3) are conceivablyeffective for increase of the drain current.

5. Field Effect Mobility

FIG. 10 is a graph showing the relations between the strength ofelectric fields (Gate Oxide Field) formed in gate insulating films andfield effect mobility (Field Effect Mobility).

As to the respective ones of the samples 1 and 3, the magnitudes of thefield effect mobility at times of varying the electric fields formed inthe gate insulating films were examined.

FIG. 10 shows the relation between the strength of the electric fieldformed in the gate insulating film 7 and the field effect mobility inthe sample 1 with a curve C26, and shows the relation between thestrength of the electric field formed in a gate insulating film 7 andthe field effect mobility in the sample 3 with a curve C25.

Comparing the curves C25 and C26 shown in FIG. 10 with each other, it isunderstood that the field effect mobility of the sample 1 is greaterthan the field effect mobility of the sample 3. Therefore, the nitrogenplasma application step (S2) and the FGA step (S3) are conceivablyeffective as methods of improving the states of the interfaces betweenthe SiC substrate 2 and the SiO₂ films 8 and 14.

While a structure including a lateral MISFET has been illustrated in theaforementioned embodiment, the present invention can also be applied toa structure including a vertical MISFET.

Second Embodiment

FIG. 30 is a schematic sectional view of a semiconductor deviceaccording to reference example studied by the inventor in the process ofcompleting a second embodiment of the present invention.

A semiconductor device 201 includes an N-type SiC substrate 202. AnN-type SiC layer 203 is formed on the N-type SiC substrate 202 byepitaxy.

A P-type well region 204 is selectively formed on a surface layerportion of the N-type SiC layer 203. An N⁺-type source region 205 isformed on a surface layer portion of the well region 204 at an intervalfrom a peripheral edge of the well region 204.

A P⁺-type contact region 206 doped with a P-type impurity in a higherconcentration than in the well region 204 is formed inside each sourceregion 205. Each contact region 206 is formed to pass through the sourceregion 205 in the depth direction.

A gate oxide film 207 made of silicon oxide (SiO₂) is formed on theN-type SiC substrate 202.

A gate electrode 208 made of N-type polycrystalline silicon (N-typePoly-Si) is formed on the gate oxide film 207. The gate electrode 208 isopposed to a region (channel region) between the peripheral edge of thewell region 204 and a peripheral edge of the source region 205.

An interlayer dielectric film 209 made of silicon oxide is stacked onthe N-type SiC layer 203.

In the interlayer dielectric film 209, a contact hole 210 is formed on aposition opposed to each contact region 206. Each contact hole 210passes through the gate oxide film 207. The whole area of the contactregion 206 and a portion of the source region 205 around the contactregion 206 face the inner portion of each contact hole 210.

A source metal 211 made of a metallic material containing aluminum (Al)as a main component is formed on the interlayer dielectric film 209. Thesource metal 211 enters each contact hole 210 formed in the interlayerdielectric film 209, and is connected to the source region 205 and thecontact region 206.

On the back surface of the N-type SiC substrate 202, an ohmic metal 212made of nickel (Ni) or the like and a drain metal 213 made of a metallicmaterial containing aluminum as a main component are formed in thisorder from the side of the N-type SiC substrate 202.

The potential (gate voltage) of the gate electrode 208 is controlled ina state where the source metal 211 is grounded and proper positivevoltage is applied to the drain metal 213, whereby a channel is formedin the well region 204 in the vicinity of the interface between the sameand the gate oxide film 207, and current flows between the source metal211 and the drain metal 213.

In manufacturing steps for the semiconductor device 201, annealing foractivating an N-type impurity is performed after implantation of theN-type impurity into the well region 204 for forming the source region205. After the annealing, an oxide film formed in the annealing isremoved from the upper surface of the N-type SiC layer 203 including theupper surfaces of the well region 204 and the source region 205. Beforethe formation of the gate oxide film 207, a treatment of forming asacrificial oxide film on the upper surface of the N-type SiC layer 203by thermal oxidation and removing the sacrificial oxide film may beperformed in order to improve the state of the upper surface of theN-type SiC layer 203.

The source region 205 contains the impurity in a higher concentration ascompared with the N-type SiC layer 203 and the well region 204. In theannealing or the thermal oxidation, therefore, growth of the oxide filmprogresses on the upper surface of the source region 205 at a higherrate than on the upper surfaces of the N-type SiC layer 203 and the wellregion 204. Consequently, a step where the upper surface of the sourceregion 205 is lower by one stage than the upper surface of the wellregion 204 is formed after the oxide film is removed, as FIG. 31 showsthe vicinity of a peripheral edge portion of the source region 205 in anenlarged manner.

When such a step is formed, electrons (e⁻) flowing from the sourceregion 205 toward the drain metal 213 through the channel region movefrom the source region 205 to the well region 204, rise in the wellregion 204 toward the upper surface thereof, and thereafter move alongthe upper surface of the well region 204. In other words, the flow ofthe electrons in the channel region becomes not a straight line, but apath directed toward the upper surface of the well region 204 andthereafter bent to be along the upper surface of the well region 204.Therefore, channel resistance enlarges due to the path in which theelectrons flow toward the upper surface of the well region 204.

Therefore, the second embodiment provides a semiconductor device capableof approximating a movement path of carriers in a channel region to astraight line thereby reducing channel resistance.

FIG. 14 is a schematic plan view of a semiconductor device according tothe second embodiment of the present invention. FIG. 15 is a schematicsectional view of the semiconductor device taken along a cutting planeline A-A shown in FIG. 14 . Referring to FIG. 15 , only portionsconsisting of conductors are hatched, while hatching on the remainingportions is omitted. FIG. 16 is a schematic enlarged sectional view inthe vicinity of a first region of a source region and a channel regionshown in FIG. 15 .

A semiconductor device 101 has a quadrangular (generally square) outershape in plan view, as shown in FIG. 14 .

The semiconductor device 101 includes a semiconductor substrate 102, asshown in FIG. 15 . The semiconductor substrate 102 is made of SiC(N-type SiC) doped with an N-type impurity. A semiconductor layer 103 isformed on the semiconductor substrate 102 by epitaxy. In other words,the semiconductor layer 103 is an epitaxial layer made of N-type SiC.

A plurality of P-type well regions 104 are formed on a surface layerportion of the semiconductor layer 103. The plurality of well regions104 are quadrangular (generally square) in plan view, and arrayed in theform of a matrix. The depth of the well regions 104 is 0.5 to 2 μm, forexample. The well regions 104 have such an impurity concentrationprofile that the P-type impurity concentration in portions whose depthfrom the upper surfaces thereof is not more than 0.5 μm is 1×10¹⁶ to1×10¹⁹ cm⁻³, for example.

On a surface layer portion of each well region 104, an N-type sourceregion 105 is formed at an interval from a peripheral edge of the wellregion 104. The depth of the source region 105 is 0.2 to 1 μm, forexample.

In the source region 105, the N-type impurity concentration in a firstregion 105A of a prescribed width (0.2 μm, for example) from aperipheral edge thereof in plan view is lower by one to three digitsthan the N-type impurity concentration in a remaining second region(region inside the first region 105A) 105B. In other words, the sourceregion 105 has the N⁺-type second region 105B whose N-type impurityconcentration is relatively high and the N⁻-type first region 105A, inthe form of an annulus surrounding the second region 105B, whose N-typeimpurity concentration is relatively low. The first region 105A has suchan impurity concentration profile that the N-type impurity concentrationin a portion whose depth from the upper surface thereof is not more than0.2 μm is 5×10¹⁷ to 5×10¹⁹ cm⁻³, for example. The second region 105B hassuch an impurity concentration profile that the N-type impurityconcentration in a portion whose depth from the upper surface thereof isnot more than 0.2 μm is 5×10¹⁹ to 5×10²⁰ cm⁻³, for example.

A step S where the upper surface of the second region 105B is lower byone stage than the upper surface of the first region 105A is formedbetween the upper surface of the first region 105A and the upper surfaceof the second region 105B (see FIG. 16 ). The magnitude of the step S is0.2 μm, for example. No large step is formed between the upper surfaceof the first region 105A and the upper surface of the well region 104(channel region C), but the upper surfaces are generally flush with eachother.

A P⁺-type contact region 106 doped with a P-type impurity in a higherconcentration than in the well region 104 is formed at the center of thesecond region 105B of each source region 105. Each contact region 106 isformed to pass through the second region 105B in the depth direction,and the deepest portion reaches the well region 104 present under thesource region 105.

A gate insulating film 107 is formed on the semiconductor layer 103. Thegate insulating film 107 has an AlON/SiO₂ multilayer structure includinga relatively thin SiO₂ film 107A made of SiO₂ (silicon oxide) containingN (nitrogen) and an AlON film 107B made of AlON (aluminum oxynitride)and formed on the SiO₂ film 107A. The thickness of the SiO₂ film 107A is1 to 20 nm. The thickness of the AlON film 107B is 30 to 100 μm.

FIG. 17 is a sectional view illustratively showing the structure of theinterface between the SiC substrate and the SiO₂ film.

Dangling bonds of C (carbon) atoms and Si (silicon) atoms present on theinterface between the semiconductor layer 103 and the SiO₂ film 107A aresmall in number or generally nonexistent, and H (hydrogen) atoms arebonded to the C atoms and the Si atoms present on the interface betweenthe semiconductor layer 103 and the SiO₂ film 107A. In other words, theinterface between the semiconductor layer 103 and the SiO₂ film 107A ishydrogen-terminated.

As shown in FIG. 15 , a gate electrode 108 is formed on the gateinsulating film 107 (the AlON film 107B). The gate electrode 108 isopposed to the semiconductor layer 103 between the well regions 104, thechannel region C between the peripheral edge of each well region 104 anda peripheral edge of the source region 105 inside the same and part ofthe first region 105A of the source region 105 through the gateinsulating film 107. The gate electrode 108 is provided in the form of alattice in plan view as a whole, as shown in FIG. 14 . Thus, thesemiconductor device 101 has a planar gate MIS structure. The gateelectrode 108 is made of polysilicon doped with an N-type impurity or aP-type impurity, or a metallic material containing Al (aluminum).

In FIG. 14 , the gate electrode 108 is shown through an interlayerdielectric film 109 and a source metal 111 described later.

The interlayer dielectric film 109 is formed on the semiconductor layer103, as shown in FIG. 15 . The upper surface of the semiconductor layer103 is covered with the interlayer dielectric film 109, along with thegate electrode 108. The interlayer dielectric film 109 is made ofsilicon oxide, for example.

In the interlayer dielectric film 109, a contact hole 110 is formed on aposition opposed to each contact region 106. Each contact hole 110passes through the gate insulating film 107, and the whole area of thecontact region 106 and a portion of the source region 105 around thecontact region 106 face the inner portion of each contact hole 110.

The source metal 111 is formed on the interlayer dielectric film 109.The source metal 111 enters each contact hole 110 formed in theinterlayer dielectric film 109, and is connected to the source region105 and the contact region 106. The source metal 111 is made of ametallic material containing aluminum (Al) as a main component, forexample.

The interlayer dielectric film 109 and the source metal 111 areselectively removed at the centers of portions along one side edge ofthe semiconductor device 101, whereby an opening exposing part of thegate electrode 108 as a gate pad 112 for connection with an externalportion is formed, as shown in FIG. 14 .

On the back surface of the semiconductor substrate 102, an ohmic metal113 made of nickel (Ni) or the like and a drain metal 114 made of ametallic material containing aluminum as a main component are formed onthe whole surface thereof in this order from the side of thesemiconductor substrate 102, as shown in FIG. 15 .

Thus, the semiconductor device 101 includes an N-channel MISFET(Negative-channel Metal Insulator Semiconductor Field EffectTransistor).

The potential (gate voltage) of the gate electrode 108 is controlled ina state where the source metal 111 is grounded and proper positivevoltage is applied to the drain metal 114, whereby a channel is formedin the channel region C of the well region 104 in the vicinity of theinterface between the same and the gate insulating film 107, and currentflows between the source metal 111 and the drain metal 114.

The N-type impurity concentration in the first region 105A of the sourceregion 105 adjacent to the channel region C is lowered in thesemiconductor device 101, whereby no large step is formed between theupper surface of the first region 105A and the upper surface of thechannel region C (the well region 104), as shown in FIG. 16 .

Therefore, electrons (e) flowing between the source metal 111 and thedrain metal 114 move from the source region 105 to the channel region Calong the upper surface of the first region 105A, and move in thechannel region C along the upper surface thereof. In other words, thepath of the electrons in the channel region C becomes a linear pathalong the upper surface of the channel region C. Therefore, channelresistance of the semiconductor device 101 is lower than the channelresistance of the semiconductor device of FIG. 30 in which the movementpath of the electrons in the channel region becomes a bent path.

FIGS. 18A to 18K are schematic sectional views successively showingmanufacturing steps for the semiconductor device. Referring to FIGS. 18Ato 18K, only portions consisting of conductors are hatched, whilehatching on the remaining portions is omitted. FIG. 19 is amanufacturing step diagram for the gate insulating film.

In the manufacturing steps for the semiconductor device 101, adeposition layer of polysilicon is first formed on the semiconductorlayer 103 by CVD (Chemical Vapor Deposition). Then, the deposition layer(not shown) of polysilicon is selectively removed from a portion of thesemiconductor layer 103 to become the well region 104 byphotolithography and etching. Thus, a mask 141 made of polysilicon isformed on the semiconductor layer 103, as shown in FIG. 18A. Thereaftera portion of the semiconductor layer 103 exposed from the mask 141 isdoped with a P-type impurity (aluminum, for example) by ionimplantation.

Then, an oxide film (not shown) made of silicon oxide is formed tocollectively cover the semiconductor layer 103 and the mask 141.Thereafter a deposition layer (not shown) of polysilicon is formed onthe oxide film. Then, the deposition layer of polysilicon is etched backthrough the oxide film serving as an etching stopper and only prescribedportions of the deposition layer in contact with the side surfaces ofthe mask 141 are left, whereby a mask 142 integrated with the mask 141is formed as shown in FIG. 18B. Then, the oxide film exposed from themask 142 is removed. Then, a resist pattern 143 is formed on a portionof the semiconductor layer 103 to become the contact region 106 byphotolithography. Thereafter portions of the semiconductor layer 103exposed from the masks 141 and 142 and the resist pattern 143 are dopedwith an N-type impurity (phosphorus (P), for example) by ionimplantation.

After the resist pattern 143 is removed, an oxide film (not shown) madeof silicon oxide is formed again, to collectively cover thesemiconductor layer 103 and the masks 141 and 142. Thereafter adeposition layer (not shown) of polysilicon is formed on the oxide film.Then, the deposition layer of polysilicon is etched back through theoxide film serving as an etching stopper and only prescribed portions ofthe deposition layer in contact with the side surfaces of the mask 142are left, whereby a mask 144 integrated with the masks 141 and 142 isformed as shown in FIG. 18C. Then, the oxide film exposed from the mask144 is removed. Then, a resist pattern 145 is formed on the portion ofthe semiconductor layer 103 to become the contact region 106 byphotolithography. Thereafter portions of the semiconductor layer 103exposed from the masks 141, 142 and 144 and the resist pattern 145 areadditionally doped with the N-type impurity by ion implantation. Afterthe doping of the N-type impurity, the masks 141, 142 and 144 and theresist pattern 145 are removed.

In the steps shown in FIGS. 18B and 18C, the formation of the resistpatterns 143 and 145 may be omitted, and the portion of thesemiconductor layer 103 to become the contact region 106 may be dopedwith the N-type impurity. Thus, photomasks necessary for the formationof the resist patterns 143 and 145 can be omitted, and the manufacturingsteps for the semiconductor device 101 can be simplified.

Then, a resist pattern 146 is formed on the semiconductor layer 103, asshown in FIG. 18D. The resist pattern 146 exposes only the portion ofthe semiconductor layer 103 to become the contact region 106. Then, theportion of the semiconductor layer 103 exposed from the resist pattern146 is doped with a P-type impurity by ion implantation.

Thereafter annealing for activating the P-type impurity and the N-typeimpurity doped into the semiconductor layer 103 is performed, and thewell region 104, the source region 105 (the first region 105A and thesecond region 105B) and the contact region 106 are formed on the surfacelayer portion of the semiconductor layer 103, as shown in FIG. 18E. Atthe annealing, the upper surface of the semiconductor layer 103 isthermally oxidized, whereby an oxide film 147 is formed. The secondregion 105B of the source region 105 and the contact region 106 havehigher impurity concentrations as compared with the semiconductor layer103, the well region 104 and the first region 105A of the source region105, whereby the oxide film 147 relatively thickly grows on the secondregion 105B and the contact region 106.

After the oxide film 147 is removed, therefore, the upper surfaces ofthe second region 105B and the contact region 106 enter states lower byone stage than the upper surfaces of the semiconductor layer 103, thewell region 104 and the first region 105A of the source region 105, andthe step S is formed between the first region 105A and the second region105B, as shown in FIG. 18F.

After the removal of the oxide film 147, the states of the uppersurfaces of the semiconductor layer 103, the well region 104, the sourceregion 105 and the contact region 106 may be improved by forming asacrificial oxide film on the upper surfaces of the semiconductor layer103, the well region 104, the source region 105 and the contact region106 by thermal oxidation and removing the sacrificial oxide film. Inthis case, a larger step S is formed between the first region 105A andthe second region 105B after the removal of the sacrificial oxide film.

Thereafter the gate insulating film 107 is formed on the upper surfacesof the semiconductor layer 103, the well region 104, the source region105 and the contact region 106, as shown in FIG. 18G.

In order to form the gate insulating film 107, an SiO₂ film formationstep (S11), a nitrogen plasma application step (S12), an FGA (FormingGas Annealing) step (S13), an AlON film formation step (S14) and a PDA(Post Deposition Annealing) step (S15) are carried out in this order, asshown in FIG. 19 .

In the SiO₂ film formation step (S11), an SiO₂ film 107A made of SiO₂containing N is formed on the semiconductor layer 103, the well region104, the source region 105 and the contact region 106 by thermaloxidation employing gas containing N₂O (nitrogen oxide). In the nitrogenplasma application step (S12), nitrogen plasma is applied to the SiO₂film 107A. The nitrogen plasma is continuously applied over 30 minutesin a state where the semiconductor substrate 102 is heated to 500° C.,for example. Atmospheric pressure and RF output at this time are 7.5Torr and 50 W respectively, for example. The nitrogen plasma is appliedto the SiO₂ film 107A, whereby Si—O—C bonds and C—C clusters are cut anddangling bonds of C atoms and Si atoms are formed on the interfacebetween the semiconductor layer 103 and the SiO₂ film 107A.

In the FGA step (S13), the semiconductor substrate 102 (thesemiconductor layer 103) and the SiO₂ film 107A are annealed in forminggas containing 3% of H₂ (hydrogen gas) and 97% of N₂ (nitrogen gas). Forexample, annealing at a temperature of 1000° C. is performed for 30minutes, and annealing at a temperature of 450° C. is thereafterperformed for 30 minutes. Thus, H atoms are excellently introduced intothe SiO₂ film 107A, and the number of the dangling bonds of the C atomsand the Si atoms present on the interface between the semiconductorlayer 103 and the SiO₂ film 107A decreases.

In the AlON film formation step (S14), an AlON film 107B is formed onthe SiO₂ film 107A by reactive sputtering employing mixed gas of N₂ andO₂ (oxygen gas) and an Al target. In the PDA step (S15), the AlON film107B is annealed in N₂. The annealing is performed at a temperature of900° C. for 30 minutes, for example. Thus, crystallinity of the AlONfilm 107B rises, and quality of the AlON film 107B improves.

Thus, the gate insulating film 107 is formed as shown in FIG. 18G.

Then, a deposition layer 148 of polysilicon is formed on the gateinsulating film 107 (the AlON film 107B) by CVD, as shown in FIG. 18H.

Then, the deposition layer 148 is selectively removed byphotolithography and etching, and the gate electrode 108 made ofpolysilicon is formed on the gate insulating film 107, as shown in FIG.18I. Alternatively, a gate electrode 108 made of a metallic material maybe formed by forming a deposition layer of the metallic materialcontaining Al (aluminum) on the gate insulating film 107 and selectivelyremoving the deposition layer.

Then, the interlayer dielectric film 109 is formed on the gateinsulating film 107 and the gate electrode 108 by CVD, as shown in FIG.18J.

Then, the contact hole 110 passing through the interlayer dielectricfilm 109 and the gate insulating film 107 is formed by photolithographyand etching, as shown in FIG. 18K.

Thereafter the source metal 111 is formed on the interlayer dielectricfilm 109 by sputtering. Then, the gate pad 112 is formed byphotolithography and etching. Further, the ohmic metal 113 and the drainmetal 114 are formed on the back surface of the semiconductor substrate102 by sputtering. Thus, the semiconductor device 101 shown in FIG. 15is obtained.

As hereinabove described, the rate (rate of oxidation) of the growth ofthe oxide film 147 on the upper surface of the first region 105A can besuppressed low by lowering the impurity concentration in the firstregion 105A of the source region 105 adjacent to the channel region C.Therefore, formation of a large step between the upper surface of thefirst region 105A and the upper surface of the channel region C (thewell region 104) can be prevented after the removal of the oxide film147. Consequently, the path (movement path) of electrons moving from thesource region 105 to the channel region C can be approximated to astraight line, whereby reduction of channel resistance can be attained.

The impurity concentration in the second region 105B of the sourceregion 105 other than the first region 105A is higher than the impurityconcentration in the first region 105A, whereby the step S where theupper surface of the second region 105B is lower by one stage than theupper surface of the first region 105A is formed between the uppersurface of the first region 105A and the upper surface of the secondregion 105B. Even if the step S is formed between the upper surface ofthe first region 105A and the upper surface of the second region 105B,the step S does not influence the flow of the electrons in the channelregion C. Therefore, the channel resistance can be reduced withoutreducing the carrier concentration in the source region 105 byrelatively lowering the impurity concentration in the first region 105Aand relatively raising the impurity concentration in the second region105B.

In relation to the manufacturing of the gate insulating film 107,dangling bonds of C atoms and Si atoms are present on the interfacebetween the semiconductor substrate 102 and the SiO₂ film 107A in thestate where the SiO₂ film 107A is simply formed on the semiconductorsubstrate 102 (the semiconductor layer 103). After the formation of theSiO₂ film 107A, therefore, the semiconductor substrate 102 and the SiO₂film 107A are annealed in the forming gas containing H₂ (the FGA stepS13 in FIG. 19 ). Thus, H atoms are bonded to the dangling bonds of theC atoms and the Si atoms, and the interface between the semiconductorsubstrate 102 and the SiO₂ film 107A is hydrogen-terminated.Consequently, the number of defects (interface state density) on theinterface between the semiconductor substrate 102 and the SiO₂ film 107Adecreases, and the state of the interface is improved.

After the annealing of the semiconductor substrate 102 and the SiO₂ film107A, the AlON film 107B is formed on the SiO₂ film 107A (the AlON filmformation step S14 in FIG. 19 ). The AlON film 107B is present on theSiO₂ film 107A, whereby dehydrogenation from the semiconductor substrate102 and the SiO₂ film 107A is prevented. Therefore, the state of theinterface between the semiconductor substrate 102 and the SiO₂ film 107Aimproved by the hydrogen termination is maintained.

Thus, the state of the interface between the semiconductor substrate 102and the SiO₂ film 107A can be improved, and the improved state can bemaintained.

In the semiconductor device 101 whose gate insulating film 107 ismanufactured by the manufacturing method shown in FIG. 19 , therefore,the interface between the semiconductor substrate 102 and the SiO₂ film107A is hydrogen-terminated. Therefore, the semiconductor device 101 haslower interface state density and can exhibit higher channel mobility,as compared with a structure having a large number of dangling bonds onan interface between an SiC substrate and an SiO₂ film.

In the gate insulating film 107 consisting of the SiO₂ film 107A and theAlON film 107B, leakage current can be reduced while ensuring equivalentor higher electric characteristics as compared with a gate insulatingfilm consisting of only an SiO₂ film, by enlarging the thickness of theAlON film 107B. In the semiconductor device 101, therefore, reliabilityof the gate insulating film 107 is high as compared with the structureemploying the gate insulating film consisting of only the SiO₂ film.

The gate electrode 108 formed on the AlON film 107B is suitably made ofa metallic material containing Al. Thus, improvement in operating speedof the MISFET and reduction of power consumption can be attained ascompared with such a structure that the gate electrode 108 is made ofpolycrystalline silicon.

In the manufacturing steps for the gate insulating film 107, the AlONfilm 107B is annealed after the formation of the AlON film 107B (the PDAstep S15 in FIG. 19 ). Thus, crystallinity of the AlON film 107B can beraised, and quality of the AlON film 107B can be improved.

Further, the nitrogen plasma is applied to the SiO₂ film 107A before theannealing of the semiconductor substrate 102 and the SiO₂ film 107A (thenitrogen plasma application step S12 in FIG. 19 ). Thus, Si—O—C bondsand C—C clusters can be cut and dangling bonds of carbon atoms andsilicon atoms can be formed on the interface between the semiconductorsubstrate 102 and the SiO₂ film 107A. The annealing of the semiconductorsubstrate 102 and the SiO₂ film 107A is performed after the applicationof the nitrogen plasma, whereby H atoms can be easily bonded to thedangling bonds of the C atoms and the Si atoms present on the interfacebetween the semiconductor substrate 102 and the SiO₂ film 107A.Consequently, the interface between the semiconductor substrate 102 andthe SiO₂ film 107A can be excellently hydrogen-terminated.

Further, the SiO₂ film 107A is formed by the thermal oxidation employingthe gas containing the nitrogen oxide (N₂O). Thus, N atoms can beintroduced into the SiO₂ film 107A, and the dielectric constant of theSiO₂ film 107A can be raised. Consequently, the leakage current can befurther reduced.

FIG. 20 is a schematic sectional view of a semiconductor deviceaccording to a modification. Referring to FIG. 20 , portionscorresponding to the respective portions shown in FIG. 15 are denoted bythe same reference numerals as the reference numerals assigned to therespective portions. In the following, only a point different from thestructure shown in FIG. 15 is described as to the structure shown inFIG. 20 , and description of the respective portions denoted by the samereference numerals is omitted. Referring to FIG. 20 , only portionsconsisting of conductors are hatched, while hatching on the remainingportions is omitted.

While the depth of the first region 105A of the source region 105 andthe depth of the second region 105B are generally identical to eachother in the semiconductor device 101 shown in FIG. 15 , the depth of afirst region 105A of a source region 105 is smaller than the depth of asecond region 105B in a semiconductor device 151 shown in FIG. 20 . Alsowhen the depth of the first region 105A is smaller than the depth of thesecond region 105B as in the semiconductor device 151, effects similarto those of the semiconductor device 101 shown in FIG. 15 can beattained.

FIG. 21 is a schematic sectional view of a semiconductor deviceaccording to another modification. Referring to FIG. 21 , only portionsconsisting of conductors are hatched, while hatching on the remainingportions is omitted.

While the semiconductor device 101 shown in FIG. 15 and thesemiconductor device 151 shown in FIG. 20 have planar gate MISstructures, a semiconductor device 161 shown in FIG. 21 has a trenchgate MIS structure.

The semiconductor device 161 includes a semiconductor substrate 162. Thesemiconductor substrate 162 is made of SiC (N-type SiC) doped with anN-type impurity. A semiconductor layer 163 is formed on thesemiconductor substrate 162 by epitaxy. In other words, thesemiconductor layer 163 is an epitaxial layer made of N-type SiC.

A base layer portion of the semiconductor layer 163 maintains the stateafter the epitaxy, and forms an N⁻-type drain region 164. A surfacelayer portion of the semiconductor layer 163 is doped with a P-typeimpurity, to be converted to a P-type well region 165.

In the semiconductor layer 163, a gate trench 166 is formed to be dugdown from the surface thereof. The gate trench 166 is provided in theform of a lattice in plan view, similarly to the gate electrode 108shown in FIG. 14 , for example. The gate trench 166 passes through thewell region 165, and the deepest portion thereof reaches the drainregion 164.

A gate insulating film 167 is formed on the inner surface of the gatetrench 166. The gate insulating film 167 has an AlON/SiO₂ multilayerstructure including a relatively thin SiO₂ film 167A made of SiO₂(silicon oxide) containing N (nitrogen) and an AlON film 167B made ofAlON (aluminum oxynitride). The SiO₂ film 167A is in contact with theinner surface of the gate trench 166, and the AlON film 167B is formedon the SiO₂ film 167A.

The inner side of the gate insulating film 167 is filled up withpolysilicon doped with an N-type impurity or a P-type impurity, wherebya gate electrode 168 made of the doped polysilicon is embedded in thegate trench 166. Alternatively, the gate electrode 168 may be made of ametallic material containing Al (aluminum).

An N-type source region 169 is formed on a surface layer portion of thewell region 165. The depth of the source region 169 (the total depth ofa first region 169A and a second region 169B described later) is 0.5 to2 μm, for example.

In the source region 169, the N-type impurity concentration in the firstregion 169A of a prescribed depth (0.2 μm, for example) on the bottomportion thereof is lower by one to three digits than the N-type impurityconcentration in the remaining second region (region on the first region169A) 169B. In other words, the source region 169 has the N⁺-type secondregion 169B whose N-type impurity concentration is relatively high andthe N⁻-type first region 169A, formed under the second region 169B,whose N-type impurity concentration is relatively low. The N-typeimpurity concentration in the first region 169A is 5×10¹⁷ to 5×10¹⁹cm⁻³, for example, and the N-type impurity concentration in the secondregion 169B is 5×10¹⁹ to 5×10²⁰ cm³, for example.

A step S where the side surface of the second region 169B more separatesfrom the gate electrode 168 than the side surface of the first region169A is formed between the side surface of the first region 169A and theside surface of the second region 169B, due to the difference betweenthe N-type impurity concentrations in the first region 169A and thesecond region 169B. The magnitude of the step S is 0.1 μm, for example.No large step is formed between the side surface of the first region169A and the side surface of the well region 165 (channel region C), butthe side surfaces are generally flush with each other. The gateinsulating film 167 has a relatively large thickness on the side surfaceof the second region 169B, due to the difference between the N-typeimpurity concentrations in the first region 169A and the second region169B.

On the surface layer portion of the well region 165, a P⁺-type contactregion 170 is formed to pass through the source region 169 in thethickness direction on a position at an interval from the gate trench166 in each region surrounded by the gate trench 166.

An interlayer dielectric film 171 is stacked on the semiconductor layer163. The interlayer dielectric film 171 is made of silicon oxide, forexample.

In the interlayer dielectric film 171, a contact hole 172 ispenetratingly formed on a position opposed to each contact region 170.The whole area of the contact region 170 and a portion of the sourceregion 169 around the contact region 170 face the inner portion of eachcontact hole 172.

A source metal 173 is formed on the interlayer dielectric film 171. Thesource metal 173 enters each contact hole 172, and is connected to thesource region 169 and the contact region 170. The source metal 173 ismade of a metallic material containing Al as a main component, forexample.

On the back surface of the semiconductor substrate 162, an ohmic metal174 made of nickel (Ni) or the like and a drain metal 175 made of ametallic material containing aluminum as a main component are formed onthe whole surface thereof in this order from the side of thesemiconductor substrate 162.

The potential (gate voltage) of the gate electrode 168 is controlled ina state where the source metal 173 is grounded and proper positivevoltage is applied to the drain metal 175, whereby a channel is formedin the channel region C of the well region 165 in the vicinity of theinterface between the same and the gate insulating film 167, and currentflows between the source metal 173 and the drain metal 175.

FIG. 22 is a schematic enlarged sectional view in the vicinity of thefirst region of the source region and the channel region shown in FIG.21 .

The N-type impurity concentration in the first region 169A of the sourceregion 169 adjacent to the channel region C is lowered in thesemiconductor device 161, whereby no large step is formed between theside surface of the first region 169A and the side surface of thechannel region C (the well region 165).

Therefore, electrons (e⁻) flowing between the source metal 173 and thedrain metal 175 move from the source region 169 to the channel region Calong the side surface of the first region 169A (the inner surface ofthe gate trench 166), and move in the channel region C along the sidesurface thereof. In other words, the path of the electrons in thechannel C becomes a linear path along the side surface of the channelregion C. Also according to the structure of the semiconductor device161, therefore, functions/effects similar to those of the semiconductordevices 101 and 151 can be exhibited, and channel resistance of thesemiconductor device 161 is lower than the channel resistance of theconventional semiconductor device in which the movement path of theelectrons in the channel region becomes a bent path.

While such structures that the semiconductor layers 103 and 163 arestacked on the semiconductor substrates 102 and 162 have been adopted,the semiconductor layers 103 and 163 may be omitted, and the wellregions 104 and 165 and the source regions 105 and 169 etc. may beformed on the surface layer portions of the semiconductor substrates 102and 162.

Further, the conductivity type of each portion may be inverted. In otherwords, while the case where the first conductivity type is the N typeand the second conductivity type is the P type has been adopted, thefirst conductivity type may be the P type, and the second conductivitytype may be the N type.

(Characteristic Evaluation)

A sample 101 (AlON/SiO₂) having a MISFET of the structure shown in FIG.15 was prepared by the manufacturing method shown in FIGS. 18 to 19 . Inthe sample 101, the thickness of an SiO₂ film 107A is 10 nm, and thethickness of an AlON film 107B is 65 nm.

Further, a sample 102 (SiO₂) having a MOSFET of a structure obtained bystacking a gate electrode on a semiconductor substrate 102 through agate insulating film consisting of a single layer of SiO₂ was prepared.In the sample 102, the thickness of the gate insulating film is 40 nm.

1. Drain Current

FIG. 23 is a graph showing the relations between gate voltage (GateVoltage) and drain current (Drain Current) in the samples 101 and 102.

As to the respective ones of the samples 101 and 102, the magnitudes ofthe drain current at times of varying the gate voltage were examined.

FIG. 23 assigns C101 to a curve showing the relation between the gatevoltage and the drain current in the sample 101, and assigns C102 to acurve showing the relation between the gate voltage and the draincurrent in the sample 102.

2. Field Effect Mobility

FIG. 24 is a graph showing the relations between the strength ofelectric fields (Gate Oxide Field) formed in gate insulating films andfield effect mobility (Field Effect Mobility).

As to the respective ones of the samples 101 and 102, the magnitudes ofthe field effect mobility at times of varying the electric fields formedin the gate insulating films were examined.

FIG. 24 assigns C103 to a curve showing the relation between thestrength of the electric field formed in a gate insulating film 107 andthe field effect mobility in the sample 101, and assigns C104 to a curveshowing the relation between the strength of the electric field formedin the gate insulating film and the field effect mobility in the sample102.

From the curves C101 to C104 shown in FIGS. 23 and 24 , it is understoodthat transistor operating characteristics of the samples 101 and 102 aregenerally identical to each other. Also in the MISFET employing the gateinsulating film 107 consisting of the SiO₂ film 107A and the AlON film107B, the field effect mobility is generally identical to that of theMOSFET employing the gate insulating film consisting of the single layerof SiO₂, and hence no increase of interface state density is conceivablycaused by stacking the AlON film 107B on the SiO₂ film 107A.

In the evaluation (see FIG. 13 ) of the interface state densitypreviously executed by the inventors of this application, therefore, theinterface state density of the SiC-MIS structure employing the AlON/SiO₂multilayer gate insulating film more increased than the interface statedensity of the SiC-MOS structure employing the SiO₂ single-layer gateinsulating film, is conceivable as a result of reflecting defects(defects on the AlON/SiO₂ interface, for example) not influencing thetransistor operating characteristics. More specifically, this evaluationis evaluation performed by calculating each interface state density ofthe SiC-MIS structure employing the AlON/SiO₂ multilayer gate insulatingfilm and the SiC-MOS structure employing the SiO₂ single-layer gateinsulating film by a High-Low method and comparing the same.

3. Temperature Characteristics

FIG. 25 is a graph showing temperature dependency of the field effectmobility of the sample 101. FIG. 26 is a graph showing temperaturedependency of the field effect mobility of the sample 102. FIG. 27 is agraph showing the relation between each temperature and a maximum valueof the field effect mobility at each temperature at the time ofexamining the temperature dependency shown in FIGS. 25 and 26 . In thegraphs shown in FIGS. 25 and 26 , the axes of abscissas show thestrength of the electric fields formed in the gate insulating films, andthe axes of ordinates show the field effect mobility.

As to the respective ones of the samples 101 and 102, temperatures ofthe semiconductor substrates (SiC substrates) were set to 110 K, 150 K,200 K, 250 K, 300 K, 400 K, 500 K and 600 K, and the relations betweenthe strength of the electric fields formed in the gate insulating filmsand the field effect mobility at each temperature were examined. FIG. 25shows the relations at the times when the temperatures of the SiCsubstrate were 110 K, 150 K, 200 k, 250 K, 300 K, 400 K, 500 K and 600 Kwith curves C105, C106, C107, C108, C109, C110, C111 and C112respectively. FIG. 26 shows the relations at the times when thetemperatures of the SiC substrate were 110 K, 150 K, 200 k, 250 K, 300K, 400 K, 500 K and 600 K with curves C113, C114, C115, C116, C117,C118, C119 and C120 respectively. FIG. 27 shows the relation between thestrength of the electric field formed in the gate insulating film 107and the field effect mobility at each temperature in the sample 101 witha curve C121, and shows the relation between the strength of theelectric field formed in the gate insulating film and the field effectmobility at each temperature in the sample 102 with a curve C122.

Comparing the curves C121 and C122 shown in FIG. 27 with each other, itis understood that the temperature dependency of the field effectmobility of the sample 101 is smaller than the temperature dependency ofthe field effect mobility of the sample 102, although the maximum valueof the field effect mobility of the sample 101 at each temperature isslightly lower than the maximum value of the field effect mobility ofthe sample 102 at each temperature.

Comparing the curve C112 shown in FIG. 25 and the curve C120 shown inFIG. 26 with each other, it is understood that the field effect mobilityof the sample 101 is greater than the field effect mobility of thesample 102 under the condition that high electric fields (electricfields of not less than 2 MV/cm) are formed in the gate insulating filmsat high temperature. Therefore, the sample 101, i.e., the semiconductordevice 101 having the MISFET of the structure shown in FIG. 15 issuitable as a power device operating under the condition that anelectric field of 3 to 4 MV/cm is formed in the gate insulating film107.

Further, a sample 103 having a MISFET of the structure shown in FIG. 15was prepared by a method omitting the nitrogen plasma application step(S12) and the FGA step (S13) from the manufacturing steps shown in FIG.19 . In the sample 103, the thickness of an SiO₂ film 107A is 10 nm, andthe thickness of an AlON film 107B is 65 nm.

4. Drain Current

FIG. 28 is a graph showing the relations between gate voltage (GateVoltage) and drain current (Drain Current) in the samples 101 and 103.

As to the respective ones of the samples 101 and 103, the magnitudes ofthe drain current at times of varying the gate voltage were examined.

FIG. 28 shows the relation between the gate voltage and the draincurrent in the sample 101 with a curve C123, and shows the relationbetween the gate voltage and the drain current in the sample 103 with acurve C124.

Comparing the curves C123 and C124 shown in FIG. 28 with each other, itis understood that the drain current obtained in the sample 101 isgreater than the drain current obtained in the sample 103. Therefore,the nitrogen plasma application step (S12) and the FGA step (S13) areconceivably effective for increase of the drain current.

5. Field Effect Mobility

FIG. 29 is a graph showing the relations between the strength ofelectric fields (Gate Oxide Field) formed in gate insulating films andfield effect mobility (Field Effect Mobility).

As to the respective ones of the samples 101 and 103, the magnitudes ofthe field effect mobility at times of varying the electric fields formedin gate insulating films 107 were examined.

FIG. 29 shows the relation between the strength of the electric fieldformed in the gate insulating film 107 and the field effect mobility inthe sample 101 with a curve C126, and shows the relation between thestrength of the electric field formed in the gate insulating film 107and the field effect mobility in the sample 103 with a curve C125.

Comparing the curves C125 and C126 shown in FIG. 29 with each other, itis understood that the field effect mobility of the sample 101 isgreater than the field effect mobility of the sample 103. Therefore, thenitrogen plasma application step (S12) and the FGA step (S13) areconceivably effective as methods of improving the state of the interfacebetween the semiconductor substrate 102 and the SiO₂ film 107A.

Third Embodiment

As hereinabove described, high-density interface states (interfacedefects) are formed on the interface (SiO₂/SiC interface) between theSiC substrate and the gate insulating film in the MOSFET (SiC-MOSFET)employing SiC. Therefore, the SiC-MOSFET has low channel mobility.

The density of the interface states (interface state density) on theSiO₂/SiC interface can be lowered by thinning the gate insulating filmmade of SiO₂. When the gate insulating film is thinned, however, leakagecurrent increases as a result.

Therefore, a third embodiment provides a semiconductor device capable ofattaining reduction of both of interface state density on an interfacebetween a silicon carbide layer and a gate insulating film and leakagecurrent.

FIG. 32 is a schematic sectional view of a semiconductor deviceaccording to the third embodiment of the present invention.

A semiconductor device 301 includes an SiC substrate 302 made of SiC(N-type SiC) doped with an N-type impurity. An SiC layer 303 made ofN-type SiC is formed on the SiC substrate 302 by epitaxy.

A plurality of P-type well regions 304 are formed on a surface layerportion of the SiC layer 303. The plurality of well regions 304 arequadrangular (generally square) in plan view, and arrayed in the form ofa matrix.

On a surface layer portion of each well region 304, a source region 305is formed at an interval from a peripheral edge of the well region 304.The source region 305 is doped with an N-type impurity in a higherconcentration than in the SiC layer 303, to exhibit an N⁺ conductivitytype.

A contact region 306 is formed at the center of each source region 305.The contact region 306 is formed to pass through the source region 305in the depth direction, and the deepest portion reaches the well region304 present under the source region 305. The contact region 306 is dopedwith a P-type impurity in a higher concentration than in the well region304, to exhibit a P⁺ conductivity type.

A gate insulating film 307 is formed on the SiC layer 303. The gateinsulating film 307 is opposed to the SiC layer 303 between the wellregions 304, a region (channel region) between the peripheral edge ofeach well region 304 and a peripheral edge of the source region 305inside the same and part of the source region 305. The gate insulatingfilm 307 is provided in the form of a lattice in plan view as a whole.

The gate insulating film 307 has an AlON/SiO₂/SiO_(x)N_(y) multilayerstructure including an SiON film 307A made of SiO_(x)N_(y) (siliconoxynitride), an SiO₂ film 307B made of SiO₂ (silicon oxide) and formedon the SiON film 307A, and an AlON film 307C made of AlON (aluminumoxynitride) which is a high dielectric constant (High-k) insulatingmaterial and formed on the SiO₂ film 307B.

The thickness of the SiON film 307A is 1 to 5 nm. The thickness of theSiO₂ film 307B is 1 to 5 nm. The total thickness of the SiON film 307Aand the SiO₂ film 307B is 2 to 10 nm. The thickness of the AlON film307C is 10 to 200 nm. Each range includes the lower limit and the upperlimit thereof.

A gate electrode 308 is formed on the gate insulating film 307. Thus,the semiconductor device 301 has a planar gate MIS structure. The gateelectrode 308 is made of a metallic material containing Al (aluminum) asa main component.

An interlayer dielectric film 309 is formed on the SiC layer 303. Theupper surface of the SiC layer 303 is covered with the interlayerdielectric film 309, along with the gate insulating film 307 and thegate electrode 308. The interlayer dielectric film 309 is made of SiO₂,for example.

In the interlayer dielectric film 309, a contact hole 310 is formed on aposition opposed to each contact region 306. The whole area of thecontact region 306 and a portion of the source region 305 around thecontact region 306 face the inner portion of each contact hole 310.

A source metal 311 is formed on the interlayer dielectric film 309. Thesource metal 311 enters each contact hole 310 formed in the interlayerdielectric film 309, and is connected to the source region 305 and thecontact region 306. The source metal 311 is made of a metallic materialcontaining Al as a main component, for example.

On the back surface of the SiC substrate 302, a drain metal 312 made ofa metallic material containing Al as a main component is formed on thewhole surface thereof through an ohmic metal (not shown) made of Ni(nickel) or the like.

The potential (gate voltage) of the gate electrode 308 is controlled ina state where the source metal 311 is grounded and proper positivevoltage is applied to the drain metal 312, whereby a channel is formedin the channel region of the well region 304 in the vicinity of theinterface between the same and the gate insulating film 307, and currentflows between the source metal 311 and the drain metal 312.

FIG. 33 is a manufacturing step diagram for the gate insulating film.

In order to manufacture the semiconductor device 301, the SiC layer 303is formed on the SiC substrate 302 by epitaxy. Then, the well region304, the source region 305 and the contact region 306 are formed on theSiC layer 303 by a well-known technique including ion implantation orthe like. Thereafter an NO_(x) thermal oxidation step (S21), an O₂thermal oxidation step (S22), an FGA (Forming Gas Annealing) step (S23),an AlON film formation step (S24) and a PDA (Post Deposition Annealing)step (S25) are carried out in this order, in order to form the gateinsulating film 307.

In the NO_(x) thermal oxidation step (S21), an SiON film made ofSiO_(x)N_(y) is formed on the SiC layer 303 by thermal oxidationemploying gas containing N₂O (nitrogen oxide).

In the O₂ thermal oxidation step (S22), an SiO₂ film made of SiO₂ isformed on the SiON film by thermal oxidation employing dry gas of O₂.

In the FGA step (S23), the SiO₂ film is annealed in forming gascontaining 3% of H₂ (hydrogen gas) and 97% of N₂ (nitrogen gas). Forexample, annealing at a temperature of 1000° C. is performed for 30minutes, and annealing at a temperature of 450° C. is thereafterperformed for 30 minutes. Thus, H atoms are excellently introduced intothe SiO₂ film, and the number of dangling bonds of C atoms and Si atomspresent on the interface between the SiC layer 303 and the SiON filmdecreases.

In the AlON film formation step (S24), an AlON film is formed on theSiO₂ film by reactive sputtering employing mixed gas of N₂ and O₂(oxygen gas) and an Al target.

In the PDA step (S25), the AlON film is annealed in N₂. The annealing isperformed at a temperature of 900° C. for 10 minutes, for example. Thus,crystallinity of the AlON film rises, and quality of the AlON filmimproves.

Thereafter the gate electrode 308 is formed on the AlON film. The gateelectrode 308 is formed by selectively vapor-depositing the material(Al) for the gate electrode on the surface of the AlON film with a mask,for example. Then, exposed portions (portions not opposed to the gateelectrode 308) of the AlON film, the SiO₂ film and the SiON film areremoved in this order by photolithography and etching, and the AlONfilm, the SiO₂ film and the SiON film are worked into the AlON film307C, the SiO₂ film 307B and the SiON film 307A respectively. When theinterlayer dielectric film 309, the contact hole 310, the source metal311 and the drain metal 312 are thereafter formed by well-known methods,the semiconductor device 301 shown in FIG. 32 is obtained.

As hereinabove described, the gate insulating film 307 has the structureobtained by stacking the SiON film 307A, the SiO₂ film 307B and the AlONfilm 307C from the side of the SiC layer 303.

The SiON film 307A is interposed between the SiC layer 303 and the SiO₂film 307B, whereby reduction of interface state density Dit on theinterface between the SiC layer 303 (SiC) and the gate insulating film307 can be attained as compared with such a structure that a gateinsulating film consists of only a silicon oxide film. Further,improvement of channel mobility can be attained due to the reduction ofthe interface state density Dit.

In addition, reduction of leakage current resulting from increase in thethickness of the gate insulating film 307 can be attained whilesuppressing increase in the interface state density on the interfacebetween the SiC layer 303 and the gate insulating film 307 by reducingthe total thickness of the SiON film 307A and the SiO₂ film 307B andincreasing the thickness of the AlON film 307C.

Therefore, both of improvement of the channel mobility resulting fromthe reduction of the interface state density Dit and improvement ofreliability of the gate insulating film 307 resulting from the reductionof the leakage current can be attained.

The gate electrode 308 is made of the metallic material containing Al.Thus, improvement in operating speed of the MISFET (field effecttransistor of a planar gate MIS structure) constituted of the SiC layer303, the gate insulating film 307 and the gate electrode 308 etc. andreduction of power consumption can be attained as compared with such astructure that the gate electrode 308 is made of polycrystallinesilicon.

(Interface State Density)

A sample 201 having the SiC-MIS structure (the structure including theAlON/SiO₂/SiO_(x)N_(y) multilayer gate insulating film on SiC) shown inFIG. 32 was prepared. In the sample 201, the thickness of an SiON film307A is 5 nm, the thickness of an SiO₂ film 307B is 5 nm and thethickness of an AlON film 307C is 80 nm.

Further, a sample 202 having an SiC-MIS structure employing an AlON/SiO₂multilayer gate insulating film (gate insulating film of a structureobtained by stacking an SiO₂ film made of SiO₂ and an AlON film made ofAlON on SiC in this order) was prepared. In the sample 202, thethickness of the SiO₂ film is 10 nm, and the thickness of the AlON filmis 80 nm.

As to the respective ones of the samples 201 and 202, high-frequency CVcharacteristics (at a measuring frequency of 100 kHz, for example) andlow-frequency CV characteristics (quasi-static CV characteristics) weremeasured, and the differences between high-frequency measured values andlow-frequency measured values were calculated as the interface statedensity Dit by a High-Low method. FIG. 34 shows the results. Referringto FIG. 34 , the axis of abscissas shows energy (Ec-E) from valence bandedges of the gate insulating films, and the axis of ordinates shows theinterface state density Dit.

From the results shown in FIG. 34 , it is understood that the interfacestate density Dit in the sample 201 is lower than the interface statedensity Dit of the sample 202.

FIG. 35 is another manufacturing step diagram for the gate insulatingfilm.

The gate insulating film 307 shown in FIG. 32 can be formed by atechnique including the manufacturing steps shown in FIG. 35 , in placeof the technique including the manufacturing steps shown in FIG. 33 . Inthe manufacturing steps shown in FIG. 35 , a nitrogen plasma applicationstep (S31), an O₂ thermal oxidation step (S32), an FGA step (S33), anAlON film formation step (S34) and a PDA step (S35) are carried out inthis order.

In the nitrogen plasma application step (S31), nitrogen plasma isapplied to the SiC layer 303. The nitrogen plasma is continuouslyapplied over 30 minutes in a state where the SiC layer 303 is heated to500° C., for example. Atmospheric pressure and RF output at this timeare 9.5 Torr and 50 W respectively, for example. Thus, an SiON film isformed on the SiC layer 303.

In the O₂ thermal oxidation step (S32), an SiO₂ film made of SiO₂ isformed on the SiON film by thermal oxidation employing dry gas of O₂.

In the FGA step (S33), the AlON film formation step (S34) and the PDAstep (S35), treatments similar to those in the FGA step (S23), the AlONfilm formation step (S24) and the PDA step (S25) shown in FIG. 33 areperformed respectively.

FIG. 36 is a schematic sectional view of a semiconductor deviceaccording to a modification.

While the semiconductor device 301 shown in FIG. 32 has the planar gateMIS structure, a semiconductor device 351 shown in FIG. 36 has a trenchgate MIS structure.

The semiconductor device 351 includes an SiC substrate 352 made ofN-type SiC. An SiC layer 353 made of N-type SiC is formed on the SiCsubstrate 352 by epitaxy.

A base layer portion of the SiC layer 353 maintains the state after theepitaxy, and forms an N⁻-type drain region 354. A surface layer portionof the SiC layer 353 is doped with a P-type impurity, to be converted toa P-type well region 355.

In the SiC layer 353, a gate trench 356 is formed to be dug down fromthe surface thereof. The gate trench 356 is provided in the form of alattice in plan view, for example. The gate trench 356 passes throughthe well region 355, and the deepest portion thereof reaches the drainregion 354.

A gate insulating film 357 is formed on the inner surface of the gatetrench 356. A peripheral edge portion of the gate insulating film 357 isin contact with the upper surface of the SiC layer 353 on the outside ofthe gate trench 356. The gate insulating film 357 has anAlON/SiO₂/SiO_(x)N_(y) multilayer structure including an SiON film 357Amade of SiO_(x)N_(y), an SiO₂ film 357B made of SiO₂ and formed on theSiON film 357A, and an AlON film 357C made of AlON which is a highdielectric constant insulating material and formed on the SiO₂ film357B.

The thickness of the SiON film 357A is 1 to 5 nm. The thickness of theSiO₂ film 357B is 1 to 5 nm. The total thickness of the SiON film 357Aand the SiO₂ film 357B is 2 to 10 nm. The thickness of the AlON film357C is 10 to 200 nm. Each range includes the lower limit and the upperlimit thereof.

A gate electrode 358 made of a metallic material containing Al as a maincomponent is formed on the gate insulating film 357.

An N-type source region 359 is formed on a surface layer portion of thewell region 355.

On the surface layer portion of the well region 355, further, a contactregion 360 is formed to pass through the source region 359 in thethickness direction on a position at an interval from the gate trench356 in each region surrounded by the gate trench 356. The contact region360 is doped with a P-type impurity in a higher concentration than inthe well region 355, to exhibit a P⁺ conductivity type.

An interlayer dielectric film 361 is stacked on the SiC layer 353. Theinterlayer dielectric film 361 is made of silicon oxide, for example.

In the interlayer dielectric film 361, a contact hole 362 ispenetratingly formed on a position opposed to each contact region 360.The whole area of the contact region 360 and a portion of the sourceregion 359 around the contact region 360 face the inner portion of eachcontact hole 362.

A source metal 363 is formed on the interlayer dielectric film 361. Thesource metal 363 enters each contact hole 362, and is connected to thesource region 359 and the contact region 360. The source metal 363 ismade of a metallic material containing Al as a main component, forexample.

On the back surface of the SiC substrate 352, a drain metal 364 made ofa metallic material containing Al as a main component is formed on thewhole surface thereof through an ohmic metal (not shown) made of Ni orthe like.

The potential (gate voltage) of the gate electrode 358 is controlled ina state where the source metal 363 is grounded and proper positivevoltage is applied to the drain metal 364, whereby a channel is formedin a channel region of the well region 355 in the vicinity of theinterface between the same and the gate insulating film 357, and currentflows between the source metal 363 and the drain metal 364.

Also in the semiconductor device 351, functions/effects similar to thoseof the semiconductor device 301 shown in FIG. 32 can be attained.

FIG. 37 is a schematic sectional view of a semiconductor deviceaccording to another modification.

While the semiconductor device 301 shown in FIG. 32 and thesemiconductor device 351 shown in FIG. 36 include vertical MISFETS, asemiconductor device 381 shown in FIG. 37 includes a lateral MISFET.

The semiconductor device 381 includes an SiC substrate 382 as a siliconcarbide layer made of N-type SiC.

A P-type well region 383 is formed on a surface layer portion of the SiCsubstrate 382.

A source region 384 and a drain region 385 are formed on a surface layerportion of the well region 383. The source region 384 and the drainregion 385 are formed at intervals from a peripheral edge portion of thewell region 383 respectively, and at an interval from each other. Thesource region 384 and the drain region 385 are doped with an N-typeimpurity in higher concentrations than in the SiC substrate 382, toexhibit N⁺ conductivity types.

A contact region 386 is formed on the surface layer portion of the wellregion 383. The contact region 386 is formed adjacently to a side of thesource region 384 opposite to the drain region 385. The contact region386 is doped with a P-type impurity in a higher concentration than inthe well region 383, to exhibit a P⁺ conductivity type.

A gate insulating film 387 is formed on a region (channel region)between the source region 384 and the drain region 385. Morespecifically, the gate insulating film 387 is opposed to the regionbetween the source region 384 and the drain region 385, and extends overa peripheral edge portion of the source region 384 and a peripheral edgeportion of the drain region 385. The gate insulating film 387 has anAlON/SiO₂/SiO_(x)N_(y) multilayer structure including an SiON film 387Amade of SiO_(x)N_(y), an SiO₂ film 387B made of SiO₂ and formed on theSiON film 387A, and an AlON film 387C made of AlON which is a highdielectric constant insulating material and formed on the SiO₂ film387B.

The thickness of the SiON film 387A is 1 to 5 nm. The thickness of theSiO₂ film 387B is 1 to 5 nm. The total thickness of the SiON film 387Aand the SiO₂ film 387B is 2 to 10 nm. The thickness of the AlON film387C is 10 to 200 nm. Each range includes the lower limit and the upperlimit thereof.

A gate electrode 388 having the same shape as the gate insulating film387 in plan view is formed on the gate insulating film 387. The gateelectrode 388 is made of a metallic material containing Al.

A source electrode 389 is formed on the source region 384 and thecontact region 386. The source electrode 389 is in contact with thesurfaces of the source region 384 and the contact region 386 whileextending over the same. The source electrode 389 is made of a metallicmaterial containing Al.

A drain electrode 390 is formed on the drain region 385. The drainelectrode 390 is in contact with the surface of the drain region 385.The drain electrode 390 is made of a metallic material containing Al.

Voltage of not less than a threshold is applied to the gate electrode388 in a state where the source electrode 389 is grounded and positivevoltage is applied to the drain electrode 390, whereby a channel isformed in the channel region of the well region 383 in the vicinity ofthe interface between the same and the gate insulating film, and currentflows from the drain electrode 390 toward the source electrode 389.

Also in the semiconductor device 381, functions/effects similar to thoseof the semiconductor device 301 shown in FIG. 32 can be attained.

While such structures that the SiC layers 303 and 353 are stacked on theSiC substrates 302 and 352 have been adopted, the SiC layers 303 and 353may be omitted, and the well regions 304 and 355 and the source regions305 and 359 etc. may be formed on the surface layer portions of the SiCsubstrates 302 and 352.

Further, the conductivity type of each portion of the semiconductordevices 301, 351 and 381 may be inverted.

The materials for the gate electrodes 308, 358 and 388 are notrestricted to the metallic materials containing Al, but may bepolysilicon doped with an N-type impurity or a P-type impurity.

While the AlON film 307C, the AlON film 357C and the AlON film 387C havebeen illustrated as high dielectric constant insulating films, thematerial for the high dielectric constant insulating films is notrestricted to AlON, but may be a high dielectric constant material suchas Al₂O₃ (aluminum oxide), ZrO (zirconium oxide), HfO (hafnium oxide) orAlN (aluminum nitride).

Fourth Embodiment

A fourth embodiment provides a semiconductor device capable ofapproximating a movement path of carriers in a channel region to astraight line thereby reducing channel resistance.

FIG. 38 is a schematic plan view of a semiconductor device according tothe fourth embodiment of the present invention. FIG. 39 is a schematicsectional view of the semiconductor device taken along a cutting planeline B-B shown in FIG. 38 . Referring to FIG. 39 , only portionsconsisting of conductors are hatched, while hatching on the remainingportions is omitted.

A semiconductor device 401 has a quadrangular (generally square) outershape in plan view, as shown in FIG. 38 .

The semiconductor device 401 includes a semiconductor substrate (SiCsubstrate) 402, as shown in FIG. 39 . The semiconductor substrate 402 ismade of SiC (N-type SiC) doped with an N-type impurity. A semiconductorlayer (SiC layer) 403 is formed on the semiconductor substrate 402 byepitaxy. In other words, the semiconductor layer 403 is an epitaxiallayer made of N-type SiC.

A plurality of P-type well regions 404 are formed on a surface layerportion of the semiconductor layer 403. The plurality of well regions404 are quadrangular (generally square) in plan view, and arrayed in theform of a matrix. The depth of the well regions 404 is 0.5 to 2 μm, forexample. The well regions 404 have such an impurity concentrationprofile that the P-type impurity concentration in portions whose depthfrom the upper surfaces thereof is not more than 0.5 μm is 1×10¹⁶ to1×10¹⁹ cm⁻³, for example.

On a surface layer portion of each well region 404, a source region 405is formed at an interval from a peripheral edge of the well region 404.The source region 405 is doped with an N-type impurity in a higherconcentration than in the semiconductor layer 403, to exhibit an N⁺conductivity type. The depth of the source region 405 is 0.2 to 1 μm,for example.

In the source region 405, the N-type impurity concentration in a firstregion 405A of a prescribed width (0.2 μm, for example) from aperipheral edge thereof in plan view is lower by one to three digitsthan the N-type impurity concentration in a remaining second region(region inside the first region 405A) 405B. In other words, the sourceregion 405 has the N⁺-type second region 405B whose N-type impurityconcentration is relatively high and the N⁻-type first region 405A, inthe form of an annulus surrounding the second region 405B, whose N-typeimpurity concentration is relatively low. The first region 405A has suchan impurity concentration profile that the N-type impurity concentrationin a portion whose depth from the upper surface thereof is not more than0.2 μm is 5×10¹⁷ to 5×10¹⁹ cm⁻³, for example. The second region 405B hassuch an impurity concentration profile that the N-type impurityconcentration in a portion whose depth from the upper surface thereof isnot more than 0.2 μm is 5×10¹⁹ to 5×10²⁰ cm⁻³, for example.

A step S where the upper surface of the second region 405B is lower byone stage than the upper surface of the first region 405A is formedbetween the upper surface of the first region 405A and the upper surfaceof the second region 405B. The magnitude of the step S is 0.2 μm, forexample. No large step is formed between the upper surface of the firstregion 405A and the upper surface of the well region 404 (channel regionC), but the upper surfaces are generally flush with each other.

A P⁺-type contact region 406 doped with a P-type impurity in a higherconcentration than in the well region 404 is formed at the center of thesecond region 405B of each source region 405. Each contact region 406 isformed to pass through the second region 405B in the depth direction,and the deepest portion reaches the well region 404 present under thesource region 405.

A gate insulating film 407 is formed on the semiconductor layer 403. Thegate insulating film 407 is opposed to the semiconductor layer 403between the well regions 404, a region (channel region) between theperipheral edge of each well region 404 and a peripheral edge of thesource region 405 inside the same and part of the source region 405. Thegate insulating film 407 is provided in the form of a lattice in planview as a whole.

The gate insulating film 407 has an AlON/SiO₂/SiO_(x)N_(y) multilayerstructure including an SiON film 407A made of SiO_(x)N_(y) (siliconoxynitride), an SiO₂ film 407B made of SiO₂ (silicon oxide) and formedon the SiON film 407A, and an AlON film 407C made of AlON (aluminumoxynitride) which is a high dielectric constant (High-k) insulatingmaterial and formed on the SiO₂ film 407B.

The thickness of the SiON film 407A is 1 to 5 nm. The thickness of theSiO₂ film 407B is 1 to 5 nm. The total thickness of the SiON film 407Aand the SiO₂ film 407B is 2 to 10 nm. The thickness of the AlON film407C is 10 to 200 nm. Each range includes the lower limit and the upperlimit thereof.

A gate electrode 408 is formed on the gate insulating film 407. The gateelectrode 408 is opposed to the semiconductor layer 403 between the wellregions 404, the channel region C between the peripheral edge of eachwell region 404 and the peripheral edge of the source region 405 insidethe same and part of the first region 405A of the source region 405through the gate insulating film 407. The gate electrode 408 is providedin the form of a lattice in plan view as a whole, as shown in FIG. 38 .Thus, the semiconductor device 401 has a planar gate MIS structure. Thegate electrode 408 is made of polysilicon doped with an N-type impurityor a P-type impurity, or a metallic material containing Al (aluminum) asa main component.

In FIG. 38 , the gate electrode 408 is shown through an interlayerdielectric film 409 and a source metal 411 described later.

The interlayer dielectric film 409 is formed on the semiconductor layer403, as shown in FIG. 39 . The upper surface of the semiconductor layer403 is covered with the interlayer dielectric film 409, along with thegate insulating film 407 and the gate electrode 408. The interlayerdielectric film 409 is made of silicon oxide, for example.

In the interlayer dielectric film 409, a contact hole 410 is formed on aposition opposed to each contact region 406. Each contact hole 410passes through the gate insulating film 407, and the whole area of thecontact region 406 and a portion of the source region 405 around thecontact region 406 face the inner portion of each contact hole 410.

The source metal 411 is formed on the interlayer dielectric film 409.The source metal 411 enters each contact hole 410 formed in theinterlayer dielectric film 409, and is connected to the source region405 and the contact region 406. The source metal 411 is made of ametallic material containing aluminum (Al) as a main component, forexample.

The interlayer dielectric film 409 and the source metal 411 areselectively removed at the centers of portions along one side edge ofthe semiconductor device 401, whereby an opening exposing part of thegate electrode 408 as a gate pad 412 for connection with an externalportion is formed, as shown in FIG. 38 .

On the back surface of the semiconductor substrate 402, an ohmic metal413 made of nickel (Ni) or the like and a drain metal 414 made of ametallic material containing aluminum as a main component are formed onthe whole surface thereof in this order from the side of thesemiconductor substrate 402.

The potential (gate voltage) of the gate electrode 408 is controlled ina state where the source metal 411 is grounded and proper positivevoltage is applied to the drain metal 414, whereby a channel is formedin the channel region C of the well region 404 in the vicinity of theinterface between the same and the gate insulating film 407, and currentflows between the source metal 411 and the drain metal 414.

FIG. 40 is a schematic enlarged sectional view in the vicinity of thefirst region of the source region and the channel region shown in FIG.39 .

The N-type impurity concentration in the first region 405A of the sourceregion 405 adjacent to the channel region C is lowered in thesemiconductor device 401, whereby no large step is formed between theupper surface of the first region 405A and the upper surface of thechannel region C (the well region 404).

Therefore, electrons (e⁻) flowing between the source metal 411 and thedrain metal 414 move from the source region 405 to the channel region Calong the upper surface of the first region 405A, and move in thechannel region C along the upper surface thereof. In other words, thepath of the electrons in the channel region C becomes a linear pathalong the upper surface of the channel region C. Therefore, channelresistance of the semiconductor device 401 is lower than the channelresistance of the semiconductor device of FIG. 30 in which the movementpath of the electrons in the channel region becomes a bent path.

FIGS. 41A to 41K are schematic sectional views successively showingmanufacturing steps for the semiconductor device. Referring to FIGS. 41Ato 41K, only portions consisting of conductors are hatched, whilehatching on the remaining portions is omitted. FIG. 42 is amanufacturing step diagram for the gate insulating film.

In the manufacturing steps for the semiconductor device 401, adeposition layer of polysilicon is first formed on the semiconductorlayer 403 by CVD (Chemical Vapor Deposition). Then, the deposition layer(not shown) of polysilicon is selectively removed from a portion of thesemiconductor layer 403 to become the well region 404 byphotolithography and etching. Thus, a mask 441 made of polysilicon isformed on the semiconductor layer 403, as shown in FIG. 41A. Thereaftera portion of the semiconductor layer 403 exposed from the mask 441 isdoped with a P-type impurity (aluminum, for example) by ionimplantation.

Then, an oxide film (not shown) made of silicon oxide is formed tocollectively cover the semiconductor layer 403 and the mask 441.Thereafter a deposition layer (not shown) of polysilicon is formed onthe oxide film. Then, the deposition layer of polysilicon is etched backthrough the oxide film serving as an etching stopper and only prescribedportions of the deposition layer in contact with the side surfaces ofthe mask 441 are left, whereby a mask 442 integrated with the mask 441is formed, as shown in FIG. 41B. Then, the oxide film exposed from themask 442 is removed. Then, a resist pattern 443 is formed on a portionof the semiconductor layer 403 to become the contact region 406 byphotolithography. Thereafter portions of the semiconductor layer 403exposed from the masks 441 and 442 and the resist pattern 443 are dopedwith an N-type impurity (phosphorus (P), for example) by ionimplantation.

After the resist pattern 443 is removed, an oxide film (not shown) madeof silicon oxide is formed again, to collectively cover thesemiconductor layer 403 and the masks 441 and 442. Thereafter adeposition layer (not shown) of polysilicon is formed on the oxide film.Then, the deposition layer of polysilicon is etched back through theoxide film serving as an etching stopper and only prescribed portions ofthe deposition layer in contact with the side surfaces of the mask 442are left, whereby a mask 444 integrated with the masks 441 and 442 isformed, as shown in FIG. 41C. Then, the oxide film exposed from the mask444 is removed. Then, a resist pattern 445 is formed on the portion ofthe semiconductor layer 403 to become the contact region 406 byphotolithography. Thereafter portions of the semiconductor layer 403exposed from the masks 441, 442 and 444 and the resist pattern 445 areadditionally doped with the N-type impurity by ion implantation. Afterthe doping of the N-type impurity, the masks 441, 442 and 444 and theresist pattern 445 are removed.

In the steps shown in FIGS. 41B and 41C, the formation of the resistpatterns 443 and 445 may be omitted, and the portion of thesemiconductor layer 403 to become the contact region 406 may be dopedwith the N-type impurity. Thus, photomasks necessary for the formationof the resist patterns 443 and 445 can be omitted, and the manufacturingsteps for the semiconductor device 401 can be simplified.

Then, a resist pattern 446 is formed on the semiconductor layer 403, asshown in FIG. 41D. The resist pattern 446 exposes only the portion ofthe semiconductor layer 403 to become the contact region 406. Then, theportion of the semiconductor layer 403 exposed from the resist pattern446 is doped with a P-type impurity by ion implantation.

Thereafter annealing for activating the P-type impurity and the N-typeimpurity doped into the semiconductor layer 403 is performed, and thewell region 404, the source region 405 (the first region 405A and thesecond region 405B) and the contact region 406 are formed on the surfacelayer portion of the semiconductor layer 403, as shown in FIG. 41E.Further, the upper surface of the semiconductor layer 403 is thermallyoxidized in the annealing, whereby an oxide film 447 is formed. Thesecond region 405B of the source region 405 and the contact region 406have higher impurity concentrations as compared with the semiconductorlayer 403, the well region 404 and the first region 405A of the sourceregion 405, whereby the oxide film 447 relatively thickly grows on thesecond region 405B and the contact region 406.

After the oxide film 447 is removed, therefore, the upper surfaces ofthe second region 405B and the contact region 406 enter states lower byone stage than the upper surfaces of the semiconductor layer 403, thewell region 404 and the first region 405A of the source region 405, anda step S is formed between the first region 405A and the second region405B, as shown in FIG. 41F.

After the removal of the oxide film 447, the states of the uppersurfaces of the semiconductor layer 403, the well region 404, the sourceregion 405 and the contact region 406 may be improved by forming asacrificial oxide film on the upper surfaces of the semiconductor layer403, the well region 404, the source region 405 and the contact region406 by thermal oxidation and removing the sacrificial oxide film. Inthis case, a larger step S is formed between the first region 405A andthe second region 405B after removal of the sacrificial oxide film.

Thereafter the gate insulating film 407 is formed on the upper surfacesof the semiconductor layer 403, the well region 404, the source region405 and the contact region 406 by thermal oxidation, as shown in FIG.41G.

In order to form the gate insulating film 407, an NO_(x) thermaloxidation step (S41), an O₂ thermal oxidation step (S42), an FGA(Forming Gas Annealing) step (S43), an AlON film formation step (S44)and a PDA (Post Deposition Annealing) step (S45) are carried out in thisorder, as shown in FIG. 42 .

In the NO_(x) thermal oxidation step (S41), the SiON film 407A made ofSiO_(x)N_(y) is formed on the semiconductor layer 403 by thermaloxidation employing gas containing N₂O (nitrogen oxide).

In the O₂ thermal oxidation step (S42), the SiO₂ film 407B made of SiO₂is formed on the SiON film 407A by thermal oxidation employing dry gasof O₂.

In the FGA step (S43), the SiO₂ film 407B is annealed in forming gascontaining 3% of H₂ (hydrogen gas) and 97% of N₂ (nitrogen gas). Forexample, annealing at a temperature of 1000° C. is performed for 30minutes, and annealing at a temperature of 450° C. is thereafterperformed for 30 minutes. Thus, H atoms are excellently introduced intothe SiO₂ film 407B, and the number of dangling bonds of C atoms and Siatoms present on the interface between the semiconductor layer 403 andthe SiON film 407A decreases.

In the AlON film formation step (S44), the AlON film 407C is formed onthe SiO₂ film 407B by reactive sputtering employing mixed gas of N₂ andO₂ (oxygen gas) and an Al target.

In the PDA step (S45), the AlON film 407C is annealed in N₂. Theannealing is performed at a temperature of 900° C. for 10 minutes, forexample. Thus, crystallinity of the AlON film 407C rises, and quality ofthe AlON film 407C improves.

Thus, the gate insulating film 407 is formed as shown in FIG. 41G.

Then, a deposition layer 448 of polysilicon is formed on the gateinsulating film 407 by CVD, as shown in FIG. 41H.

Then, the deposition layer 448 is selectively removed byphotolithography and etching, and the gate electrode 408 made ofpolysilicon is formed on the gate insulating film 407, as shown in FIG.41I. Alternatively, a gate electrode 408 made of a metallic material maybe formed by forming a deposition layer of the metallic materialcontaining Al (aluminum) on the gate insulating film 407 and selectivelyremoving the deposition layer.

Then, the interlayer dielectric film 409 is formed on the gateinsulating film 407 and the gate electrode 408 by CVD, as shown in FIG.41J.

Then, the contact hole 410 passing through the interlayer dielectricfilm 409 and the gate insulating film 407 is formed by photolithographyand etching, as shown in FIG. 41K.

Thereafter the source metal 411 is formed on the interlayer dielectricfilm 409 by sputtering. Then, the gate pad 412 is formed byphotolithography and etching. Further, the ohmic metal 413 and the drainmetal 414 are formed on the back surface of the semiconductor substrate402 by sputtering. Thus, the semiconductor device 401 shown in FIG. 39is obtained.

As hereinabove described, the rate (rate of oxidation) of growth of theoxide film 447 on the upper surface of the first region 405A can besuppressed low by lowering the impurity concentration in the firstregion 405A of the source region 405 adjacent to the channel region C.Therefore, formation of a large step between the upper surface of thefirst region 405A and the upper surface of the channel region C (thewell region 404) can be prevented after removal of the oxide film 447.Consequently, the path (movement path) of electrons moving from thesource region 405 to the channel region C can be approximated to astraight line, whereby reduction of channel resistance can be attained.

The impurity concentration in the second region 405B of the sourceregion 405 other than the first region 405A is higher than the impurityconcentration in the first region 405A, whereby the step S where theupper surface of the second region 405B is lower by one stage than theupper surface of the first region 405A is formed between the uppersurface of the first region 405A and the upper surface of the secondregion 405B. Even if the step S is formed between the upper surface ofthe first region 405A and the upper surface of the second region 405B,the step S does not influence the flow of the electrons in the channelregion C. Therefore, the channel resistance can be reduced withoutreducing the carrier concentration in the source region 405 byrelatively lowering the impurity concentration in the first region 405Aand relatively raising the impurity concentration in the second region405B.

The gate insulating film 407 has the structure obtained by stacking theSiON film 407A, the SiO₂ film 407B and the AlON film 407C from the sideof the semiconductor layer 403.

The SiON film 407A is interposed between the semiconductor layer 403 andthe SiO₂ film 407B, whereby reduction of interface state density Dit onthe interface between the semiconductor layer 403 (SiC) and the gateinsulating film 407 can be attained as compared with such a structurethat a gate insulating film consists of only a silicon oxide film.Further, improvement of the channel mobility can be attained due to thereduction of the interface state density Dit.

In addition, reduction of leakage current resulting from increase in thethickness of the gate insulating film 407 can be attained whilesuppressing increase in the interface state density on the interfacebetween the semiconductor layer 403 and the gate insulating film 407 byreducing the total thickness of the SiON film 407A and the SiO₂ film407B and increasing the thickness of the AlON film 407C.

Therefore, both of improvement of the channel mobility resulting fromthe reduction of the interface state density Dit and improvement ofreliability of the gate insulating film 407 resulting from the reductionof the leakage current can be attained.

The gate electrode 408 is suitably made of a metallic materialcontaining Al. Thus, improvement in operating speed of a MISFET (fieldeffect transistor of a planar gate MIS structure) constituted of thesemiconductor layer 403, the gate insulating film 407 and the gateelectrode 408 etc. and reduction of power consumption can be attained ascompared with such a structure that the gate electrode 408 is made ofpolycrystalline silicon.

(Interface State Density)

A sample 301 having the SiC-MIS structure (the structure including theAlON/SiO₂/SiO_(x)N_(y) multilayer gate insulating film on SiC) shown inFIG. 39 was prepared. In the sample 301, the thickness of an SiON film407A is 5 nm, the thickness of an SiO₂ film 407B is 5 nm, and thethickness of an AlON film 407C is 80 nm.

A sample 302 having an SiC-MIS structure employing an AlON/SiO₂multilayer gate insulating film (gate insulating film of a structureobtained by stacking an SiO₂ film made of SiO₂ and an AlON film made ofAlON on SiC in this order) was prepared. In the sample 302, thethickness of the SiO₂ film is 10 nm, and the thickness of the AlON filmis 80 nm.

As to the respective ones of the samples 301 and 302, high-frequency CVcharacteristics (at a measuring frequency of 100 kHz, for example) andlow-frequency CV characteristics (quasi-static CV characteristics) weremeasured, and the differences between high-frequency measured values andlow-frequency measured values were calculated as the interface statedensity Dit by a High-Low method. FIG. 43 shows the results. Referringto FIG. 34 , the axis of abscissas shows energy (Ec-E) from valence bandedges of the gate insulating films, and the axis of ordinates shows theinterface state density Dit.

From the results shown in FIG. 43 , it is understood that the interfacestate density Dit in the sample 301 is lower than the interface statedensity Dit of the sample 302. FIG. 44 is another manufacturing stepdiagram for the gate insulating film.

The gate insulating film 407 shown in FIG. 39 can be formed by atechnique including the manufacturing steps shown in FIG. 44 , in placeof the technique including the manufacturing steps shown in FIG. 42 . Inthe manufacturing steps shown in FIG. 44 , a nitrogen plasma applicationstep (S51), an O₂ thermal oxidation step (S52), an FGA step (S53), anAlON film formation step (S54) and a PDA step (S55) are carried out inthis order.

In the nitrogen plasma application step (S51), nitrogen plasma isapplied to the semiconductor layer 403. The nitrogen plasma iscontinuously applied over 30 minutes in a state where the semiconductorlayer 403 is heated to 500° C., for example. Atmospheric pressure and RFoutput at this time are 9.5 Torr and 50 W respectively, for example.Thus, the SiON film 407A is formed on the semiconductor layer 403.

In the O₂ thermal oxidation step (S52), the SiO₂ film 407B made of SiO₂is formed on the SiON film 407A by thermal oxidation employing dry gasof O₂.

In the FGA step (S53), the AlON film formation step (S54) and the PDAstep (S55), treatments similar to those in the FGA step (S43), the AlONfilm formation step (S44) and the PDA step (S45) shown in FIG. 42 areperformed respectively.

FIG. 45 is a schematic sectional view of a semiconductor deviceaccording to a modification. Referring to FIG. 45 , portionscorresponding to the respective portions shown in FIG. 39 are denoted bythe same reference numerals as the reference numerals assigned to therespective portions. In the following, only a point different from thestructure shown in FIG. 39 is described as to the structure shown inFIG. 45 , and description of the respective portions denoted by the samereference numerals is omitted. Referring to FIG. 45 , only portionsconsisting of conductors are hatched, while hatching on the remainingportions is omitted.

While the depth of the first region 405A of the source region 405 andthe depth of the second region 405B are generally identical to eachother in the semiconductor device 401 shown in FIG. 39 , the depth of afirst region 405A of a source region 405 is smaller than the depth of asecond region 405B in a semiconductor device 451 shown in FIG. 45 . Alsowhen the depth of the first region 405A is smaller than the depth of thesecond region 405B as in the semiconductor device 451, effects similarto those of the semiconductor device 401 shown in FIG. 39 can beattained.

FIG. 46 is a schematic sectional view of a semiconductor deviceaccording to another modification. Referring to FIG. 46 , only portionsconsisting of conductors are hatched, while hatching on the remainingportions is omitted.

While the semiconductor device 401 shown in FIG. 39 and thesemiconductor device 451 shown in FIG. 45 have planar gate MISstructures, a semiconductor device 461 shown in FIG. 46 has a trenchgate MIS structure.

The semiconductor device 461 includes a semiconductor substrate 462. Thesemiconductor substrate 462 is made of SiC (N-type SiC) doped with anN-type impurity. A semiconductor layer 463 is formed on thesemiconductor substrate 462 by epitaxy. In other words, thesemiconductor layer 463 is an epitaxial layer made of N-type SiC.

A base layer portion of the semiconductor layer 463 maintains the stateafter the epitaxy, and forms an N⁻-type drain region 464. A surfacelayer portion of the semiconductor layer 463 is doped with a P-typeimpurity, to be converted to a P-type well region 465.

In the semiconductor layer 463, a gate trench 466 is formed to be dugdown from the surface thereof. The gate trench 466 is provided in theform of a lattice in plan view, similarly to the gate electrode 408shown in FIG. 38 , for example. The gate trench 466 passes through thewell region 465, and the deepest portion thereof reaches the drainregion 464.

A gate insulating film 467 is formed on the inner surface of the gatetrench 466. The gate insulating film 467 has an AlON/SiO₂/SiO_(x)N_(y)multilayer structure including an SiON film 467A made of SiO_(x)N_(y),an SiO₂ film 467B made of SiO₂ and formed on the SiON film 467A, and anAlON film 467C made of AlON which is a high dielectric constantinsulating material and formed on the SiO₂ film 467B.

The thickness of the SiON film 467A is 1 to 5 nm. The thickness of theSiO₂ film 467B is 1 to 5 nm. The total thickness of the SiON film 467Aand the SiO₂ film 467B is 2 to 10 nm. The thickness of the AlON film467C is 10 to 200 nm. Each range includes the lower limit and the upperlimit thereof.

The inner side of the gate insulating film 467 is filled up withpolysilicon doped with an N-type impurity or a P-type impurity, wherebya gate electrode 468 made of the doped polysilicon is embedded in thegate trench 466. Alternatively, the gate electrode 468 may be made of ametallic material containing Al (aluminum).

An N-type source region 469 is formed on a surface layer portion of thewell region 465. The depth (the total depth of a first region 469A and asecond region 469B described later) of the source region 469 is 0.5 to 2μm, for example.

In the source region 469, the N-type impurity concentration in the firstregion 469A of a prescribed depth (0.2 μm, for example) on the bottomportion thereof is lower by one to three digits than the N-type impurityconcentration in the remaining second region (region on the first region469A) 469B. In other words, the source region 469 has the N⁺-type secondregion 469B whose N-type impurity concentration is relatively high andthe N⁻-type first region 469A, formed under the second region 469B,whose N-type impurity concentration is relatively low. The N-typeimpurity concentration in the first region 469A is 5×10¹⁷ to 5×10¹⁹cm⁻³, for example, and the N-type impurity concentration in the secondregion 469B is 5×10¹⁹ to 5×10²⁰ cm⁻³, for example.

A step S where the side surface of the second region 469B more separatesfrom the gate electrode 468 than the side surface of the first region469A is formed between the side surface of the first region 469A and theside surface of the second region 469B, due to the difference betweenthe N-type impurity concentrations in the first region 469A and thesecond region 469B. The magnitude of the step S is 0.1 μm, for example.No large step is formed between the side surface of the first region469A and the side surface of the well region 465 (channel region C), butthe side surfaces are generally flush with each other. The gateinsulating film 467 has a relatively large thickness on the side surfaceof the second region 469B, due to the difference between the N-typeimpurity concentrations in the first region 469A and the second region469B.

On the surface layer portion of the well region 465, a P⁺-type contactregion 470 is formed to pass through the source region 469 in thethickness direction on a position at an interval from the gate trench466 in each region surrounded by the gate trench 466.

An interlayer dielectric film 471 is stacked on the semiconductor layer463. The interlayer dielectric film 471 is made of silicon oxide, forexample.

In the interlayer dielectric film 471, a contact hole 472 ispenetratingly formed on a position opposed to each contact region 470.The whole area of the contact region 470 and a portion of the sourceregion 469 around the contact region 470 face the inner portion of eachcontact hole 472.

A source metal 473 is formed on the interlayer dielectric film 471. Thesource metal 473 enters each contact hole 472, and is connected to thesource region 469 and the contact region 470. The source metal 473 ismade of a metallic material containing Al as a main component, forexample.

On the back surface of the semiconductor substrate 462, an ohmic metal474 made of nickel (Ni) or the like and a drain metal 475 made of ametallic material containing aluminum as a main component are formed onthe whole surface thereof in this order from the side of thesemiconductor substrate 462.

The potential (gate voltage) of the gate electrode 468 is controlled ina state where the source metal 473 is grounded and proper positivevoltage is applied to the drain metal 475, whereby a channel is formedin the channel region C of the well region 465 in the vicinity of theinterface between the same and the gate insulating film 467, and currentflows between the source metal 473 and the drain metal 475.

FIG. 47 is a schematic enlarged sectional view in the vicinity of thefirst region of the source region and the channel region shown in FIG.46 .

The N-type impurity concentration in the first region 469A of the sourceregion 469 adjacent to the channel region C is lowered in thesemiconductor device 461, whereby no large step is formed between theside surface of the first region 469A and the side surface of thechannel region C (the well region 465).

Therefore, electrons (e) flowing between the source metal 473 and thedrain metal 475 move from the source region 469 to the channel region Calong the side surface of the first region 469A (the inner surface ofthe gate trench 466), and move in the channel region C along the sidesurface thereof. In other words, the path of the electrons in thechannel region C becomes a linear path along the side surface of thechannel region C. Also according to the structure of the semiconductordevice 461, therefore, functions/effects similar to those of thesemiconductor devices 401 and 451 can be exhibited, and channelresistance of the semiconductor device 461 is lower than the channelresistance of the semiconductor device of FIG. 30 in which the movementpath of the electrons in the channel region becomes a bent path.

Also in the semiconductor device 461, both of improvement of channelmobility and improvement of reliability of the gate insulating film 467can be attained, similarly to the semiconductor device 401 shown in FIG.39 .

FIG. 48 is a schematic sectional view of a semiconductor deviceaccording to still another modification.

While the semiconductor device 401 shown in FIG. 39 and thesemiconductor device 451 shown in FIG. 45 include vertical MISFETS, asemiconductor device 481 shown in FIG. 48 includes a lateral MISFET.

The semiconductor device 481 includes an SiC substrate 482 as a siliconcarbide layer made of N-type SiC.

A P-type well region 483 is formed on a surface layer portion of the SiCsubstrate 482.

A source region 484 and a drain region 485 are formed on a surface layerportion of the well region 483. The source region 484 and the drainregion 485 are formed at intervals from a peripheral edge portion of thewell region 483 respectively, and at an interval from each other. Thesource region 484 and the drain region 485 are doped with an N-typeimpurity in higher concentrations than in the SiC substrate 482, toexhibit N⁺ conductivity types.

A contact region 486 is formed on the surface layer portion of the wellregion 483. The contact region 486 is formed adjacently to a side of thesource region 484 opposite to the drain region 485. The contact region486 is doped with a P-type impurity in a higher concentration than inthe well region 483, to exhibit a P⁺ conductivity type.

A gate insulating film 487 is formed on a region (channel region)between the source region 484 and the drain region 485. Morespecifically, the gate insulating film 487 is opposed to the regionbetween the source region 484 and the drain region 485, and extends overa peripheral edge portion of the source region 484 and a peripheral edgeportion of the drain region 485. The gate insulating film 487 has anAlON/SiO₂/SiO_(x)N_(y) multilayer structure including an SiON film 487Amade of SiO_(x)N_(y), an SiO₂ film 487B made of SiO₂ and formed on theSiON film 487A, and an AlON film 487C made of AlON which is a highdielectric constant insulating material and formed on the SiO₂ film487B.

The thickness of the SiON film 487A is 1 to 5 nm. The thickness of theSiO₂ film 487B is 1 to 5 nm. The total thickness of the SiON film 487Aand the SiO₂ film 487B is 2 to 10 nm. The thickness of the AlON film487C is 10 to 200 nm. Each range includes the lower limit and the upperlimit thereof.

A gate electrode 488 having the same shape as the gate insulating film487 in plan view is formed on the gate insulating film 487. The gateelectrode 488 is made of a metallic material containing Al.

A source electrode 489 is formed on the source region 484 and thecontact region 486. The source region 489 is in contact with thesurfaces of the source region 484 and the contact region 486 whileextending over the same. The source electrode 489 is made of a metallicmaterial containing Al.

A drain electrode 490 is formed on the drain region 485. The drainelectrode 490 is in contact with the surface of the drain region 485.The drain electrode 490 is made of a metallic material containing Al.

Voltage of not less than a threshold is applied to the gate electrode488 in a state where the source electrode 489 is grounded and positivevoltage is applied to the drain electrode 490, whereby a channel isformed in the channel region of the well region 483 in the vicinity ofthe interface between the same and the gate insulating film 487, andcurrent flows from the drain electrode 490 toward the source electrode489.

Also in the semiconductor device 481, functions/effects similar to thoseof the semiconductor device 401 shown in FIG. 39 can be attained.

While the structures in which the semiconductor layers 403 and 463 arestacked on the semiconductor substrates (SiC substrates) 402 and 462have been adopted, the semiconductor layers 403 and 463 may be omitted,and the well regions 404 and 465 and the source regions 405 and 469 etc.may be formed on the surface layer portions of the SiC substrates 402and 462.

Further, the conductivity type of each portion of the semiconductordevices 401, 451, 461 and 481 may be inverted. In other words, while thecase where the first conductivity type is the N type and the secondconductivity type is the P type has been adopted, the first conductivitytype may be the P type, and the second conductivity type may be the Ntype.

The materials for the gate electrodes 408, 468 and 488 are notrestricted to the metallic materials containing Al, but may bepolysilicon doped with an N-type impurity or a P-type impurity.

While the AlON film 407C, the AlON film 467C and the AlON film 487C havebeen illustrated as high dielectric constant insulating films, thematerial for the high dielectric constant insulating films is notrestricted to AlON, but may be a high dielectric constant material suchas Al₂O₃ (aluminum oxide), ZrO (zirconium oxide), HfO (hafnium oxide) orAlN (aluminum nitride).

Fifth Embodiment

A fifth embodiment provides a semiconductor device capable ofapproximating a movement path of carriers in a channel region to astraight line thereby reducing channel resistance.

FIG. 49 is a schematic plan view of a semiconductor device according tothe fifth embodiment of the present invention. FIG. 50 is a schematicsectional view of the semiconductor device taken along a cutting planeline C-C shown in FIG. 49 . Referring to FIG. 50 , only portionsconsisting of conductors are hatched, while hatching on the remainingportions is omitted.

A semiconductor device 601 has a quadrangular (generally square) outershape in plan view, as shown in FIG. 49 .

The semiconductor device 601 includes a semiconductor substrate 602, asshown in FIG. 50 . The semiconductor substrate 602 is made of SiC(N-type SiC) doped with an N-type impurity. A semiconductor layer 603 isformed on the semiconductor substrate 602 by epitaxy. In other words,the semiconductor layer 603 is an epitaxial layer made of N-type SiC.

A plurality of P-type well regions 604 are formed on a surface layerportion of the semiconductor layer 603. The plurality of well regions604 are quadrangular (generally square) in plan view, and arrayed in theform of a matrix. The depth of the well regions 604 is 0.5 to 2 μm, forexample. The well regions 604 have such an impurity concentrationprofile that the P-type impurity concentration in portions whose depthfrom the upper surfaces thereof is not more than 0.5 μm is 1×10¹⁶ to1×10¹⁹ cm⁻³, for example.

On a surface layer portion of each well region 604, an N-type sourceregion 605 is formed at an interval from a peripheral edge of the wellregion 604. The depth of the source region 605 is 0.2 to 1 μm, forexample.

In the source region 605, the N-type impurity concentration in a firstregion 605A of a prescribed width (0.2 μm, for example) from aperipheral edge thereof in plan view is lower by one to three digitsthan the N-type impurity concentration in a remaining second region(region inside the first region 605A) 605B. In other words, the sourceregion 605 has the N⁺-type second region 605B whose N-type impurityconcentration is relatively high and the N⁻-type first region 605A, inthe form of an annulus surrounding the second region 605B, whose N-typeimpurity concentration is relatively low. The first region 605A has suchan impurity concentration profile that the N-type impurity concentrationin a portion whose depth from the upper surface thereof is not more than0.2 μm is 5×10¹⁷ to 5×10¹⁹ cm⁻³, for example. The second region 605B hassuch an impurity concentration profile that the N-type impurityconcentration in a portion whose depth from the upper surface thereof isnot more than 0.2 μm is 5×10¹⁹ to 5×10²⁰ cm³, for example.

A step S where the upper surface of the second region 605B is lower byone stage than the upper surface of the first region 605A is formedbetween the upper surface of the first region 605A and the upper surfaceof the second region 605B. The magnitude of the step S is 0.2 μm, forexample. No large step is formed between the upper surface of the firstregion 605A and the upper surface of the well region 604 (channel regionC), but the upper surfaces are generally flush with each other.

A P⁺-type contact region 606 doped with a P-type impurity in a higherconcentration than in the well region 604 is formed at the center of thesecond region 605B of each source region 605. Each contact region 606 isformed to pass through the second region 605B in the depth direction,and the deepest portion reaches the well region 604 present under thesource region 605.

A gate insulating film 607 is formed on the semiconductor layer 603. Thegate insulating film 607 is made of silicon oxide (SiO₂), for example.

A gate electrode 608 is formed on the gate insulating film 607. The gateelectrode 608 is opposed to the semiconductor layer 603 between the wellregions 604, the channel region C between the peripheral edge of eachwell region 604 and a peripheral edge of the source region 605 insidethe same and part of the first region 605A of the source region 605through the gate insulating film 607. The gate electrode 608 is providedin the form of a lattice in plan view as a whole, as shown in FIG. 49 .Thus, the semiconductor device 601 has a planar gate MIS structure. Thegate electrode 608 is made of polysilicon doped with an N-type impurityor a P-type impurity.

In FIG. 49 , the gate electrode 608 is shown through an interlayerdielectric film 609 and a source metal 611 described later.

The interlayer dielectric film 609 is formed on the semiconductor layer603, as shown in FIG. 50 . The upper surface of the semiconductor layer603 is covered with the interlayer dielectric film 609, along with thegate electrode 608. The interlayer dielectric film 609 is made ofsilicon oxide, for example.

In the interlayer dielectric film 609, a contact hole 610 is formed on aposition opposed to each contact region 606. Each contact hole 610passes through the gate insulating film 607, and the whole area of thecontact region 606 and a portion of the source region 605 around thecontact region 606 face the inner portion of each contact hole 610.

The source metal 611 is formed on the interlayer dielectric film 609.The source metal 611 enters each contact hole 610 formed in theinterlayer dielectric film 609, and is connected to the source region605 and the contact region 606. The source metal 611 is made of ametallic material containing aluminum (Al) as a main component, forexample.

The interlayer dielectric film 609 and the source metal 611 areselectively removed at the centers of portions along one side edge ofthe semiconductor device 601, whereby an opening exposing part of thegate electrode 608 as a gate pad 612 for connection with an externalportion is formed, as shown in FIG. 49 .

On the back surface of the semiconductor substrate 602, an ohmic metal613 made of nickel (Ni) or the like and a drain metal 614 made of ametallic material containing aluminum as a main component are formed onthe whole surface thereof in this order from the side of thesemiconductor substrate 602, as shown in FIG. 50 .

The potential (gate voltage) of the gate electrode 608 is controlled ina state where the source metal 611 is grounded and proper positivevoltage is applied to the drain metal 614, whereby a channel is formedin the channel region C of the well region 604 in the vicinity of theinterface between the same and the gate insulating film 607, and currentflows between the source metal 611 and the drain metal 614.

FIG. 51 is a schematic enlarged sectional view in the vicinity of thefirst region of the source region and the channel region shown in FIG.50 .

The N-type impurity concentration in the first region 605A of the sourceregion 605 adjacent to the channel region C is lowered in thesemiconductor device 601, whereby no large step is formed between theupper surface of the first region 605A and the upper surface of thechannel region C (the well region 604).

Therefore, electrons (e) flowing between the source metal 611 and thedrain metal 614 move from the source region 605 to the channel region Calong the upper surface of the first region 605A, and move in thechannel region C along the upper surface thereof. In other words, thepath of the electrons in the channel region C becomes a linear pathalong the upper surface of the channel region C. Therefore, channelresistance of the semiconductor device 601 is lower than the channelresistance of the semiconductor device of FIG. 30 in which the movementpath of the electrons in the channel region becomes a bent path.

FIGS. 52A to 52K are schematic sectional views successively showingmanufacturing steps for the semiconductor device. Referring to FIGS. 52Ato 52K, only portions consisting of conductors are hatched, whilehatching on the remaining portions is omitted.

In the manufacturing steps for the semiconductor device 601, adeposition layer of polysilicon is first formed on the semiconductorlayer 603 by CVD (Chemical Vapor Deposition). Then, the deposition layer(not shown) of polysilicon is selectively removed from a portion of thesemiconductor layer 603 to become the well region 604 byphotolithography and etching. Thus, a mask 641 made of polysilicon isformed on the semiconductor layer 603, as shown in FIG. 52A. Thereaftera portion of the semiconductor layer 603 exposed from the mask 641 isdoped with a P-type impurity (aluminum, for example) by ionimplantation.

Then, an oxide film (not shown) made of silicon oxide is formed tocollectively cover the semiconductor layer 603 and the mask 641.Thereafter a deposition layer (not shown) of polysilicon is formed onthe oxide film. Then, the deposition layer of polysilicon is etched backthrough the oxide film serving as an etching stopper and only prescribedportions of the deposition layer in contact with the side surfaces ofthe mask 641 are left, whereby a mask 642 integrated with the mask 641is formed, as shown in FIG. 52B. Then, the oxide film exposed from themask 642 is removed. Then, a resist pattern 643 is formed on a portionof the semiconductor layer 603 to become the contact region 606 byphotolithography. Thereafter portions of the semiconductor layer 603exposed from the masks 641 and 642 and the resist pattern 643 are dopedwith an N-type impurity (phosphorus (P), for example) by ionimplantation.

After the resist pattern 643 is removed, an oxide film (not shown) madeof silicon oxide is formed again, to collectively cover thesemiconductor layer 603 and the masks 641 and 642. Thereafter adeposition layer (not shown) of polysilicon is formed on the oxide film.Then, the deposition layer of polysilicon is etched back through theoxide film serving as an etching stopper and only prescribed portions ofthe deposition layer in contact with the side surfaces of the mask 642are left, whereby a mask 644 integrated with the masks 641 and 642 isformed, as shown in FIG. 52C. Then, the oxide film exposed from the mask644 is removed. Then, a resist pattern 645 is formed on the portion ofthe semiconductor layer 603 to become the contact region 606 byphotolithography. Thereafter portions of the semiconductor layer 603exposed from the masks 641, 642 and 644 and the resist pattern 645 areadditionally doped with the N-type impurity by ion implantation. Afterthe doping of the N-type impurity, the masks 641, 642 and 644 and theresist pattern 645 are removed.

In the steps shown in FIGS. 52B and 52C, the formation of the resistpatterns 643 and 645 may be omitted, and the portion of thesemiconductor layer 603 to become the contact region 606 may be dopedwith the N-type impurity. Thus, photomasks necessary for the formationof the resist patterns 643 and 645 can be omitted, and the manufacturingsteps for the semiconductor device 601 can be simplified.

Then, a resist pattern 646 is formed on the semiconductor layer 603, asshown in FIG. 52D. The resist pattern 646 exposes only the portion ofthe semiconductor layer 603 to become the contact region 606. Then, theportion of the semiconductor layer 603 exposed from the resist pattern646 is doped with a P-type impurity by ion implantation.

Thereafter annealing for activating the P-type impurity and the N-typeimpurity doped into the semiconductor layer 603 is performed, and thewell region 604, the source region 605 (the first region 605A and thesecond region 605B) and the contact region 606 are formed on the surfacelayer portion of the semiconductor layer 603, as shown in FIG. 52E. Atthe annealing, the upper surface of the semiconductor layer 603 isthermally oxidized, whereby an oxide film 647 is formed. The secondregion 605B of the source region 605 and the contact region 606 havehigher impurity concentrations as compared with the semiconductor layer603, the well region 604 and the first region 605A of the source region605, whereby the oxide film 647 relatively thickly grows on the secondregion 605B and the contact region 606.

After the oxide film 647 is removed, therefore, the upper surfaces ofthe second region 605B and the contact region 606 enter states lower byone stage than the upper surfaces of the semiconductor layer 603, thewell region 604 and the first region 605A of the source region 605, andthe step S is formed between the first region 605A and the second region605B, as shown in FIG. 52F.

After the removal of the oxide film 647, the states of the uppersurfaces of the semiconductor layer 603, the well region 604, the sourceregion 605 and the contact region 606 may be improved by forming asacrificial oxide film on the upper surfaces of the semiconductor layer603, the well region 604, the source region 605 and the contact region606 by thermal oxidation and removing the sacrificial oxide film. Inthis case, a larger step S is formed between the first region 605A andthe second region 605B after the removal of the sacrificial oxide film.

Thereafter the gate insulating film 607 is formed on the upper surfacesof the semiconductor layer 603, the well region 604, the source region605 and the contact region 606 by thermal oxidation, as shown in FIG.52G.

Then, a deposition layer 648 of polysilicon is formed on the gateinsulating film 607 by CVD, as shown in FIG. 52H.

Then, the deposition layer 648 is selectively removed byphotolithography and etching, and the gate electrode 608 made ofpolysilicon is formed on the gate insulating film 607, as shown in FIG.52I.

Then, the interlayer dielectric film 609 is formed on the gateinsulating film 607 and the gate electrode 608 by CVD, as shown in FIG.52J.

Then, the contact hole 610 passing through the interlayer dielectricfilm 609 and the gate insulating film 607 is formed by photolithographyand etching, as shown in FIG. 52K.

Thereafter the source metal 611 is formed on the interlayer dielectricfilm 609 by sputtering. Then, the gate pad 612 is formed byphotolithography and etching. Further, the ohmic metal 613 and the drainmetal 614 are formed on the back surface of the semiconductor substrate602 by sputtering. Thus, the semiconductor device 601 shown in FIG. 50is obtained.

As hereinabove described, the rate (rate of oxidation) of growth of theoxide film 647 on the upper surface of the first region 605A can besuppressed low by lowering the impurity concentration in the firstregion 605A of the source region 605 adjacent to the channel region C.Therefore, formation of a large step between the upper surface of thefirst region 605A and the upper surface of the channel region C (thewell region 604) can be prevented after the removal of the oxide film647. Consequently, the path (movement path) of the electrons moving fromthe source region 605 in the channel region C can be approximated to astraight line, whereby reduction of channel resistance can be attained.

The impurity concentration in the second region 605B of the sourceregion 605 other than the first region 605A is higher than the impurityconcentration in the first region 605A, whereby the step S where theupper surface of the second region 605B is lower by one stage than theupper surface of the first region 605A is formed between the uppersurface of the first region 605A and the upper surface of the secondregion 605B. Even if the step S is formed between the upper surface ofthe first region 605A and the upper surface of the second region 605B,the step S does not influence the flow of the electrons in the channelregion C. Therefore, the channel resistance can be reduced withoutreducing the carrier concentration in the source region 605 byrelatively lowering the impurity concentration in the first region 605Aand relatively raising the impurity concentration in the second region605B.

FIG. 53 is a schematic sectional view of a semiconductor deviceaccording to a modification. Referring to FIG. 53 , portionscorresponding to the respective portions shown in FIG. 50 are denoted bythe same reference numerals as the reference numerals assigned to therespective portions. In the following, only a point different from thestructure shown in FIG. 50 is described as to the structure shown inFIG. 53 , and description of the respective portions denoted by the samereference numerals is omitted. Referring to FIG. 53 , only portionsconsisting of conductors are hatched, while hatching on the remainingportions is omitted.

While the depth of the first region 605A of the source region 605 andthe depth of the second region 605B are generally identical to eachother in the semiconductor device 601 shown in FIG. 50 , the depth of afirst region 605A of a source region 605 is smaller than the depth of asecond region 605B in a semiconductor device 651 shown in FIG. 53 . Alsowhen the depth of the first region 605A is smaller than the depth of thesecond region 605B as in the semiconductor device 651, effects similarto those of the semiconductor device 601 shown in FIG. 50 can beattained.

FIG. 54 is a schematic sectional view of a semiconductor deviceaccording to another modification. Referring to FIG. 54 , only portionsconsisting of conductors are hatched, while hatching on the remainingportions is omitted.

While the semiconductor device 601 shown in FIG. 50 and thesemiconductor device 651 shown in FIG. 53 have planar gate MISstructures, a semiconductor device 661 shown in FIG. 54 has a trenchgate MIS structure.

The semiconductor device 661 includes a semiconductor substrate 662. Thesemiconductor substrate 662 is made of SiC (N-type SiC) doped with anN-type impurity. A semiconductor layer 663 is formed on thesemiconductor substrate 662 by epitaxy. In other words, thesemiconductor layer 663 is an epitaxial layer made of N-type SiC.

A base layer portion of the semiconductor layer 663 maintains the stateafter the epitaxy, and forms an N⁻-type drain region 664. A surfacelayer portion of the semiconductor layer 663 is doped with a P-typeimpurity, to be converted to a P-type well region 665.

In the semiconductor layer 663, a gate trench 666 is formed to be dugdown from the surface thereof. The gate trench 666 is provided in theform of a lattice in plan view, similarly to the gate electrode 608shown in FIG. 49 , for example. The gate trench 666 passes through thewell region 665, and the deepest portion thereof reaches the drainregion 664.

A gate insulating film 667 is formed on the inner surface of the gatetrench 666. The gate insulating film 667 is made of silicon oxide, forexample.

The inner side of the gate insulating film 667 is filled up withpolysilicon doped with an N-type impurity or a P-type impurity, wherebya gate electrode 668 made of the doped polysilicon is embedded in thegate trench 666.

An N-type source region 669 is formed on a surface layer portion of thewell region 665. The depth of the source region 669 (the total depth ofa first region 669A and a second region 669B described later) is 0.5 to2 μm, for example.

In the source region 669, the N-type impurity concentration in the firstregion 669A of a prescribed depth (0.2 μm, for example) on the bottomportion thereof is lower by one to three digits than the N-type impurityconcentration in the remaining second region (region on the first region669A) 669B. In other words, the source region 669 has the N⁺-type secondregion 669B whose N-type impurity concentration is relatively high andthe N⁻-type first region 669A, formed under the second region 669B,whose N-type impurity concentration is relatively low. The N-typeimpurity concentration in the first region 669A is 5×10¹⁷ to 5×10¹⁹cm⁻³, for example, and the N-type impurity concentration in the secondregion 669B is 5×10¹⁹ to 5×10²⁰ cm⁻³, for example.

A step S where the side surface of the second region 669B more separatesfrom the gate electrode 668 than the side surface of the first region669A is formed between the side surface of the first region 669A and theside surface of the second region 669B, due to the difference betweenthe N-type impurity concentrations in the first region 669A and thesecond region 669B. The magnitude of the step S is 0.1 μm, for example.No large step is formed between the side surface of the first region669A and the side surface of the well region 665 (channel region C), butthe side surfaces are generally flush with each other. The gateinsulating film 667 has a relatively large thickness on the side surfaceof the second region 669B, due to the difference between the N-typeimpurity concentrations in the first region 669A and the second region669B.

On the surface layer portion of the well region 665, a P⁺-type contactregion 670 is formed to pass through the source region 669 in thethickness direction on a position at an interval from the gate trench666 in each region surrounded by the gate trench 666.

An interlayer dielectric film 671 is stacked on the semiconductor layer663. The interlayer dielectric film 671 is made of silicon oxide, forexample.

In the interlayer dielectric film 671, a contact hole 672 ispenetratingly formed on a position opposed to each contact region 670.The whole area of the contact region 670 and a portion of the sourceregion 669 around the contact region 670 face the inner portion of eachcontact hole 672.

A source metal 673 is formed on the interlayer dielectric film 671. Thesource metal 673 enters each contact hole 672, and is connected to thesource region 669 and the contact region 670. The source metal 673 ismade of a metallic material containing Al as a main component, forexample.

On the back surface of the semiconductor substrate 662, an ohmic metal674 made of nickel (Ni) or the like and a drain metal 675 made of ametallic material containing aluminum as a main component are formed onthe whole surface thereof in this order from the side of thesemiconductor substrate 662.

The potential (gate voltage) of the gate electrode 668 is controlled ina state where the source metal 673 is grounded and proper positivevoltage is applied to the drain metal 675, whereby a channel is formedin the channel region C of the well region 665 in the vicinity of theinterface between the same and the gate insulating film 667, and currentflows between the source metal 673 and the drain metal 675.

FIG. 55 is a schematic enlarged sectional view in the vicinity of thefirst region of the source region and the channel region shown in FIG.54 .

The N-type impurity concentration in the first region 669A of the sourceregion 669 adjacent to the channel region C is lowered in thesemiconductor device 661, whereby no large step is formed between theside surface of the first region 669A and the side surface of thechannel region C (the well region 665).

Therefore, electrons (e⁻) flowing between the source metal 673 and thedrain metal 675 move from the source region 669 to the channel region Calong the side surface of the first region 669A (the inner surface ofthe gate trench 666), and move in the channel region C along the sidesurface thereof. In other words, the path of the electrons in thechannel region C becomes a linear path along the side surface of thechannel region C. Also according to the structure of the semiconductordevice 661, therefore, functions/effects similar to those of thesemiconductor devices 601 and 651 can be exhibited, and channelresistance of the semiconductor device 661 is lower than the channelresistance of the semiconductor device of FIG. 30 in which the movementpath of the electrons in the channel region becomes a bent path.

While such structures that the semiconductor layers 603 and 663 arestacked on the semiconductor substrates 602 and 662 have been adopted inthe aforementioned embodiment, the semiconductor layers 603 and 663 maybe omitted, and the well regions 604 and 665 and the source regions 605and 669 etc. may be formed on the surface layer portions of thesemiconductor substrates 602 and 662.

Further, the conductivity type of each portion may be inverted. In otherwords, while the case where the first conductivity type is the N typeand the second conductivity type is the P type has been adopted, thefirst conductivity type may be the P type, and the second conductivitytype may be the N type.

While the present invention has been described in detail by way of theembodiments thereof, it should be understood that these embodiments aremerely illustrative of the technical principles of the present inventionbut not limitative of the invention. The spirit and scope of the presentinvention are to be limited only by the appended claims.

DESCRIPTION OF THE REFERENCE NUMERALS

-   -   1 semiconductor device    -   2 SiC substrate (silicon carbide substrate)    -   8 SiO₂ film (silicon oxide film)    -   9 AlON film (aluminum oxynitride film)    -   10 gate electrode    -   14 SiO₂ film (silicon oxide film)    -   15 AlON film (aluminum oxynitride film)    -   16 capacitor electrode    -   101 semiconductor device    -   102 semiconductor substrate (semiconductor layer, silicon        carbide substrate)    -   103 semiconductor layer (semiconductor layer)    -   104 well region    -   105 source region    -   105A first region    -   105B second region    -   107 gate insulating film    -   107A SiO₂ film (silicon oxide film)    -   107B AlON film (aluminum oxynitride film)    -   108 gate electrode    -   151 semiconductor device    -   161 semiconductor device    -   162 semiconductor substrate (semiconductor layer)    -   163 semiconductor layer (semiconductor layer)    -   165 well region    -   166 gate trench    -   167 gate insulating film    -   168 gate electrode    -   169 source region    -   169A first region    -   169B second region    -   301 semiconductor device    -   303 SiC layer (silicon carbide layer)    -   307 gate insulating film    -   307A SiON film (silicon oxynitride film)    -   307B SiO₂ film (silicon oxide film)    -   307C AlON film (high dielectric constant insulating film)    -   308 gate electrode    -   351 semiconductor device    -   353 SiC layer (silicon carbide layer)    -   357 gate insulating film    -   357A SiON film (silicon oxynitride film)    -   357B SiO₂ film (silicon oxide film)    -   357C AlON film (high dielectric constant insulating film)    -   358 gate electrode    -   381 semiconductor device    -   382 SiC substrate (silicon carbide layer)    -   387 gate insulating film    -   387A SiON film (silicon oxynitride film)    -   387B SiO₂ film (silicon oxide film)    -   387C AlON film (high dielectric constant insulating film)    -   388 gate electrode    -   401 semiconductor device    -   402 semiconductor substrate (semiconductor layer)    -   403 semiconductor layer (semiconductor layer, silicon carbide        layer)    -   404 well region    -   405 source region    -   405A first region    -   405B second region    -   407 gate insulating film    -   408 gate electrode    -   451 semiconductor device    -   453 SiC layer (silicon carbide layer)    -   457 gate insulating film    -   457A SiON film (silicon oxynitride film)    -   457B SiO₂ film (silicon oxide film)    -   457C AlON film (high dielectric constant insulating film)    -   458 gate electrode    -   461 semiconductor device    -   462 semiconductor substrate (semiconductor layer)    -   463 semiconductor layer (semiconductor layer)    -   465 well region    -   466 gate trench    -   467 gate insulating film    -   468 gate electrode    -   469 source region    -   469A first region    -   469B second region    -   471 SiON film (silicon oxynitride film)    -   472 SiO₂ film (silicon oxide film)    -   473 AlON film (high dielectric constant insulating film)    -   481 semiconductor device    -   482 SiC substrate (silicon carbide layer)    -   487 gate insulating film    -   487A SiON film (silicon oxynitride film)    -   487B SiO₂ film (silicon oxide film)    -   487C AlON film (high dielectric constant insulating film)    -   488 gate electrode    -   601 semiconductor device    -   602 semiconductor substrate (semiconductor layer)    -   603 semiconductor layer (semiconductor layer)    -   604 well region    -   605 source region    -   605A first region    -   605B second region    -   607 gate insulating film    -   608 gate electrode    -   651 semiconductor device    -   661 semiconductor device    -   662 semiconductor substrate (semiconductor layer)    -   663 semiconductor layer (semiconductor layer)    -   665 well region    -   666 gate trench    -   667 gate insulating film    -   668 gate electrode    -   669 source region    -   669A first region    -   669B second region    -   C channel region    -   S step    -   S1 SiO₂ film formation step    -   S2 nitrogen plasma application step    -   S3 FGA step    -   S4 AlON film formation step    -   S5 PDA step

What is claimed is:
 1. A SiC semiconductor device, comprising: asemiconductor layer; a well region of a second conductivity type wellregion located at a surface layer portion of the semiconductor layer andthat has a channel region defined therein; a source region of a firstconductivity type source region located at a surface layer portion ofthe well region and that includes a first region defined adjacent to thewell region and a second region defined adjacent to the first region; agate insulating film on the semiconductor layer and located on thechannel region, the first region, and at least part of the secondregion; and a gate electrode on the gate insulating film and oppositewith the channel region of the well region where a channel is formedthrough the gate insulating film, wherein a step is located at thesurface of the semiconductor layer between an upper surface of the firstregion and an upper surface of the second region.
 2. The SiCsemiconductor device according to claim 1, wherein the source region andthe channel region are adjacently formed in a direction along an uppersurface of the semiconductor layer, and the gate insulating film is onthe upper surface of the semiconductor layer.
 3. The SiC semiconductordevice according to claim 2, further comprising a back electrodeincluding nickel at a back surface of the SiC semiconductor device. 4.The SiC semiconductor device according to claim 3, further comprising asource electrode including aluminum.
 5. The SiC semiconductor deviceaccording to claim 4, wherein a depth of the well region is from 0.5 umto 2 um.
 6. The SiC semiconductor device according to claim 5, whereinthe gate insulating film includes SiO₂.
 7. The SiC semiconductor deviceaccording to claim 6, wherein the gate electrode includes polysilicon.8. The SiC semiconductor device according to claim 7, wherein the firstregion of the source region has an impurity concentration that is lessthan that of the second region of the source region.
 9. The SiCsemiconductor device according to claim 7, further comprising a contactregion that is a second conductivity type contact region formed to passthrough both the first region and the second region of the sourceregion.
 10. The SiC semiconductor device according to claim 7, whereinthe well region has an impurity concentration profile that P-typeimpurity concentration in a portion whose depth from an upper surfacethereof is not more than 0.5 um is from 1×10¹⁶ to 1×10¹⁹ cm⁻³.
 11. TheSiC semiconductor device according to claim 7, wherein the first regionhas an impurity concentration profile that N-type impurity concentrationin a portion whose depth from an upper surface thereof is not more than0.2 um is from 5×10¹⁷ to 5×10¹⁹ cm⁻³.
 12. The SiC semiconductor deviceaccording to claim 7, wherein the second region has an impurityconcentration profile that N-type impurity concentration in a portionwhose depth from an upper surface thereof is not more than 0.2 um isfrom 5×10¹⁹ to 5×10²⁰ cm⁻³.
 13. The SiC semiconductor device accordingto claim 7, wherein the surface layer portion of the semiconductor layerhas a portion doped with a P-type impurity for the well region.
 14. TheSiC semiconductor device according to claim 7, wherein the surface layerportion of the semiconductor layer has a portion doped with a N-typeimpurity for the source region.
 15. The SiC semiconductor deviceaccording to claim 1, wherein no large step as the step between theupper surface of the first region and the upper surface of the secondregion is located between the upper surface of the first region and anupper surface of the channel region.
 16. The SiC semiconductor deviceaccording to claim 15, wherein the source region and the channel regionare adjacently formed in a direction along an upper surface of thesemiconductor layer, and the gate insulating film is located on theupper surface of the semiconductor layer.
 17. The SiC semiconductordevice according to claim 16, further comprising a back electrodeincluding nickel at a back surface of the SiC semiconductor device. 18.The SiC semiconductor device according to claim 17, further comprising asource electrode including aluminum.
 19. The SiC semiconductor deviceaccording to claim 18, wherein a depth of the well region is from 0.5 umto 2 um.
 20. The SiC semiconductor device according to claim 19, whereinthe gate insulating film includes SiO₂.
 21. The SiC semiconductor deviceaccording to claim 20, wherein the gate electrode includes polysilicon.22. The SiC semiconductor device according to claim 21, wherein thefirst region of the source region has an impurity concentration that isless than that of the second region of the source region.
 23. The SiCsemiconductor device according to claim 21, further comprising a contactregion that is a second conductivity type contact region formed to passthrough both the first region and the second region of the sourceregion.
 24. The SiC semiconductor device according to claim 21, whereinthe well region has an impurity concentration profile that P-typeimpurity concentration in a portion whose depth from an upper surfacethereof is not more than 0.5 um is from 1×10¹⁶ to 1×10¹⁹ cm⁻³.
 25. TheSiC semiconductor device according to claim 21, wherein the first regionhas an impurity concentration profile that N-type impurity concentrationin a portion whose depth from an upper surface thereof is not more than0.2 um is from 5×10¹⁷ to 5×10¹⁹ cm⁻³.
 26. The SiC semiconductor deviceaccording to claim 21, wherein the second region has an impurityconcentration profile that N-type impurity concentration in a portionwhose depth from an upper surface thereof is not more than 0.2 um isfrom 5×10¹⁹ to 5×10²⁰ cm⁻³.
 27. The SiC semiconductor device accordingto claim 21, wherein the surface layer portion of the semiconductorlayer has a portion doped with a P-type impurity for the well region.28. The SiC semiconductor device according to claim 21, wherein thesurface layer portion of the semiconductor layer has a portion dopedwith a N-type impurity for the source region.
 29. The SiC semiconductordevice according to claim 15, wherein the upper surface of the firstregion and an upper surface of the channel region are generally flushwith each other.